4Ti相在Cu基體上形成外，擴(kuò)散溶解層其余的化合物相都在Ti基體上生成。銅鈦復(fù)合界面上形成的化合物相有Cu4Ti、Cu3Ti2、CuTi、CuTi2。其中，Cu3Ti2相以“鋸齒狀”方式生長(zhǎng)，CuTi相以“竹筍狀”方式生長(zhǎng)，CuTi2相以“平面狀”方式生長(zhǎng)。擴(kuò)散溶解層的硬度值明顯高于2種純組元的硬度值。經(jīng)Miedema模型計(jì)算，界面相析出先后順序?yàn)镃uTi、Cu3Ti2、CuTi2、Cu4Ti。銅與鈦的液固復(fù)合是銅在鈦基體中的擴(kuò)散和鈦在銅液中的溶解共同作用的結(jié)果。;The Cu-Ti bimetallic composites were prepared by liquid-solid composite process, and the diffusion behavior of Cu and Ti elements at the composite interface was investigated by OM, SEM, EPMA and other testing methods. The results show that the grain boundaries are the main channels for diffusion in the process of Cu/Ti composite. Except for part of the Cu4Ti phase formed on the Cu matrix, the rest of the compound phases of the diffusively-dissolved layer are generated on the Ti matrix. The compounds generated at the Cu-Ti composite interface are Cu4Ti, Cu3Ti2, CuTi and CuTi2, where the Cu3Ti2 phase grows in a “jagged” manner, the CuTi phase grows in a “bamboo shoot” manner, and the CuTi2 phase grows in a “planar” manner. The hardness values of the diffusion-dissolved layer are significantly higher than those of the two pure components. As verified by the Miedema model, the sequence of interfacial phase precipitation is CuTi, Cu3Ti2, CuTi2 and Cu4Ti. The bonding of Cu and Ti is a combined action of Cu diffusion in Ti matrix and Ti dissolution in the Cu solution."/>