C路徑變形時(shí)剪切帶內(nèi)部的位錯(cuò)發(fā)生強(qiáng)烈的交互作用；C路徑變形后剪切帶的取向發(fā)生分散。經(jīng)過6道次變形后，單晶銅組織中形成強(qiáng)烈的{111}<112>織構(gòu)，材料強(qiáng)度從初始126.0 MPa增加到400.2 MPa，而導(dǎo)電率仍保持在98%IACS以上。低溫ECAP變形后組織內(nèi)部形成定向剪切帶并產(chǎn)生高密度的位錯(cuò)，位錯(cuò)間相互纏結(jié)，有效阻礙了位錯(cuò)滑移，而晶粒仍保持良好的單晶特性。;The deformation microstructure and texture evolution of single crystal copper after cryogenic equal channel angular pressing (Cryo-ECAP) process were characterized by optical microscope, scanning electron microscope, X-ray diffractometer, and electron backscatter diffraction. The mechanical properties and conductivity properties were analyzed. The microstructure transition mechanism and its effects on the mechanical properties and conductivity properties were discussed. Results show that the directional shear bands formed in the early stage of Cryo-ECAP process seriously affect the microstructure transformation during the subsequent deformation. With increasing the strain, a high-density dislocation pile-up is formed in the shear bands during deformation by route A, and the proportion of characteristic grain boundaries is increased. The dislocations in the shear bands during deformation by route BC present strong interactions, and the orientation of shear bands is dispersed after the deformation by route C. After 6 passes of deformation, the strong {111}<112> texture forms in the microstructure of single crystal copper, the strength increases from 126.0 MPa to 400.2 MPa, and the conductivity remains of above 98%IACS. After Cryo-ECAP, the directional shear bands form in the texture and the high-density dislocations are produced. The entanglement of dislocations effectively prevents the dislocation slip, and therefore the grains maintain the characteristics of single crystal."/>