2含量的AgCuOIn2O3SnO2電觸頭材料，利用掃描電鏡和金相顯微鏡表征了材料的微觀形貌及顯微組織，分析對(duì)比了不同SnO2含量的材料金相組織及其增強(qiáng)相的分布均勻性，并利用X射線衍射分析了材料的物相結(jié)構(gòu)。測(cè)量了材料的抗拉伸強(qiáng)度、硬度、電阻等性能。結(jié)果表明：添加適量的SnO2能使組織中的孔隙尺寸縮小、其他缺陷明顯減少。氧化物彌散分布在銀基體中，極大地改善了AgCuOIn2O3電觸頭材料的顯微組織均勻性。在SnO2含量不變時(shí)，材料的電阻率隨塑性變形程度增加而有所降低；隨著SnO2含量增多，電阻率呈現(xiàn)先降低后升高的趨勢(shì)，最后趨于定值，約為2.4 μΩ·cm。添加SnO2后各試樣材料的硬度均顯著升高，SnO2含量為1%（質(zhì)量分?jǐn)?shù)）的材料具有最優(yōu)的抗拉伸強(qiáng)度和延伸率。;AgCuOIn2O3SnO2 electrical contact materials with different SnO2 contents were prepared by reaction synthesis coupled with plastic deformation process. The morphology and microstructure of the AgCuOIn2O3SnO2 contact materials were characterized by scanning electron microscopy and optical microscope. The distribution uniformity of the metallographic structure and the reinforcement phase of the materials with different SnO2 contents was analyzed. The phase structure of the materials was measured by X-ray diffraction, and the tensile strength, hardness, and resistivity of the materials were also measured. Results show that the appropriate SnO2 addition can significantly decrease the pore size and reduce other defects in the structures. The diffusion of oxides in the silver matrix greatly improves the microstructure uniformity of AgCuOIn2O3 contact materials. When the SnO2 content is fixed, the resistivity of materials is decreased with conducting the plastic deformation; with increasing the SnO2 content, the resistivity is decreased firstly, then increased, and finally turns to be stable at 2.4 μΩ·cm. The hardness of the materials is increased significantly after SnO2 addition. The material with 1wt% SnO2 shows the optimal tensile strength and elongation."/>
2O3SnO2;顯微組織;性能;reactive synthesis;AgCuOIn2O3SnO2;microstructure;performance"/>