6Sn5金屬間化合物，即釬料基體與錫鍍層形成良好的冶金結(jié)合；隨著熱浸鍍溫度的升高和時(shí)間的延長(zhǎng)，CuPSn釬料的抗拉強(qiáng)度和顯微硬度均呈降低趨勢(shì)，抗拉強(qiáng)度的降低源于界面處產(chǎn)生的Cu6Sn5脆性化合物和孔洞，顯微硬度的降低源于熱浸鍍的去應(yīng)力退火作用；Cu93P釬料表面熱浸鍍錫可降低釬料的熔化溫度，提高釬料的潤濕性，Cu93P釬料表面熱浸鍍5.20%（質(zhì)量分?jǐn)?shù)）錫之后，Cu88.16P6.64Sn5.20在純銅板上的潤濕鋪展面積比基體Cu93P釬料增加43.15%。;The CuPSn brazing filler metal was prepared on the basis of Cu93P brazing filler metal by hot-dip tinning. The interface morphology of tin coating was observed by scanning electron microscope. The tensile strength, microhardness, melting temperature and wettability of the brazing filler metal were investigated by universal mechanical testing machine, micro-hardness tester, differential thermal analyzer, resistance furnace and stereomicroscope. The results indicate that the liquid tin reacts with the brazing filler metal to form Cu6Sn5 intermetallic compound during hot-dip tinning, which means that the brazing filler metal and tin coating form good metallurgical bonding. The tensile strength and microhardness of brazing filler metal decrease with the increase of hot-dipping temperature and time. The decrease of tensile strength is due to the formation of Cu6Sn5 brittle compound and pores at the interface, and the decrease of microhardness is due to the stress-relieving annealing effect of hot-dip. Hot-dip tinning can reduce the melting temperature and improve the wettability of the brazing filler metal. The wetting area of brazing filler metal increases by about 43.15% compared with that of the matrix when 5.20wt% tin is hot dipped in it, and the Cu88.16P6.64Sn5.20 brazing filler metal possesses a good wettability."/>