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Ni改性GNSs對SnAgCuRE/Cu釬焊接頭熱老化特性的影響
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1.河南科技大學(xué) 材料科學(xué)與工程學(xué)院，河南 洛陽 471023;2.有色金屬新材料與先進(jìn)加工技術(shù)省部共建協(xié)同創(chuàng)新中心 有色金屬共性技術(shù)河南省協(xié)同創(chuàng)新中心，河南 洛陽 471023

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國家自然科學(xué)基金項(xiàng)目（U1604132），河南省科技攻關(guān)項(xiàng)目（222102230114），河南省高等學(xué)校重點(diǎn)科研項(xiàng)目（23B430003）


Effect of Ni Modified GNSs on Thermal Aging Character-istics of SnAgCuRE/Cu Soldering Joints
Author:
Affiliation:

1.School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;2.Collaborative Innovation Center of Nonferrous Metals, Henan Province, Provincial and Ministerial Co-construction of Collaborative Innovation Center for Non-ferrous Metal New Materials and Advanced Processing Technology, Luoyang 471023, China

Fund Project:

National Natural Science Foundation of China (U1604132); Key Technology Research and Development Program of Henan Province (222102230114); Major Scientific Research Foundation of Higher Education of Henan Province, China (23B430003)

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    摘要:

    以Sn2.5Ag0.7Cu0.1RE0.05Ni無鉛釬料合金為研究對象，基于石墨烯納米片（GNS）獨(dú)特的結(jié)構(gòu)、優(yōu)異的物理性能和力學(xué)性能，以其為復(fù)合釬料的增強(qiáng)相，開展基于Ni改性GNSs（Ni-GNSs）增強(qiáng)SnAgCuRE系復(fù)合釬料/Cu的釬焊和釬焊接頭熱老化試驗(yàn)，探討Ni-GNSs對復(fù)合釬料組織及釬焊接頭熱老化失效斷裂機(jī)制的影響。結(jié)果表明：Ni-GNSs的加入，抑制了復(fù)合釬料的線膨脹，產(chǎn)生晶格畸變，導(dǎo)致位錯(cuò)產(chǎn)生，金屬間化合物（IMC）顆粒分布在位錯(cuò)線附近，與位錯(cuò)發(fā)生交互作用，阻礙位錯(cuò)運(yùn)動，強(qiáng)化復(fù)合釬料，進(jìn)而強(qiáng)化復(fù)合釬料接頭。隨著熱老化時(shí)間延長，釬焊接頭界面IMC層厚度增加，剪切強(qiáng)度降低；其中，添加0.05%（質(zhì)量分?jǐn)?shù)）GNSs的復(fù)合釬料接頭剪切強(qiáng)度降幅最小，為8.9%，且熱老化384 h后，其剪切強(qiáng)度仍高于Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu合金接頭熱老化前的剪切強(qiáng)度。Ni-GNSs的加入，使復(fù)合釬料釬焊接頭界面IMC的生長系數(shù)明顯降低，有效緩解了復(fù)合釬料/Cu釬焊接頭熱老化過程中力學(xué)性能的降低，進(jìn)而改變復(fù)合釬料/Cu釬焊接頭的熱老化失效斷裂機(jī)制，最終影響接頭的可靠性。Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu釬焊接頭的斷裂位置由熱老化前的釬縫區(qū)向釬縫/界面IMC移動，變?yōu)轫g脆混合斷裂；而添加0.05%（質(zhì)量分?jǐn)?shù)）GNSs復(fù)合釬料接頭的斷裂位置均在釬縫區(qū)，為韌性斷裂，釬焊接頭可靠性較高。

    Abstract:

    Sn2.5Ag0.7Cu0.1RE0.05Ni lead-free solder alloy was used as the research object. Based on the unique structure, excellent physical properties, and good mechanical properties of graphene nanosheets (GNSs), the Ni modified GNSs (Ni-GNSs) were used as the reinforcement phase. The soldering process of Ni-GNSs reinforced SnAgCuRE system composite solder/Cu and thermal aging tests of soldering joints were conducted to investigate the effect of Ni-GNSs on the microstructure and thermal aging fracture mechanism of composite soldering joints. Results show that the addition of Ni-GNSs inhibits the linear expansion of the composite solder, resulting in lattice distortion and dislocation. The intermetallic compound (IMC) particles near the dislocation line interact with the dislocations and hinder their movement, thereby strengthening the composite solder and further improving the soldering joint. With a longer thermal aging time, the thickness of interface IMC layer is increased and the shear strength of soldering joints is decreased. Among them, the shear strength decrement of the composite soldering joints with 0.05wt% GNS addition is the least of only 8.9%. Moreover, after thermal aging for 384 h, its shear strength is still higher than that of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joint before thermal aging. With the addition of Ni-GNSs, the growth coefficient of interface IMC of composite soldering joints is significantly reduced, which effectively alleviates the degradation of mechanical properties of composite solder/Cu soldering joints during the thermal aging process, further changes the thermal aging fracture mechanism of composite solder/Cu soldering joints, and ultimately affects the reliability of joints. The fracture position of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints moves from the soldering seam before thermal aging to the soldering seam/interface IMC, presenting the ductile-brittle mixed fracture. The fracture position of the Sn2.5Ag0.7Cu0.1RE0.05Ni-0.05GNSs/Cu soldering joints is still in the soldering seam zone, presenting the ductile fracture, which indicates the high reliability of the soldering joints.

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引用本文

王悔改,張柯柯,王冰瑩,王要利.Ni改性GNSs對SnAgCuRE/Cu釬焊接頭熱老化特性的影響[J].稀有金屬材料與工程,2024,53(6):1523~1535.[Wang Huigai, Zhang Keke, Wang Bingying, Wang Yaoli. Effect of Ni Modified GNSs on Thermal Aging Character-istics of SnAgCuRE/Cu Soldering Joints[J]. Rare Metal Materials and Engineering,2024,53(6):1523~1535.]
DOI：10.12442/j. issn.1002-185X. E20230029

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  • 收稿日期:2023-09-05
  • 最后修改日期:2023-10-25
  • 錄用日期:2023-11-13
  • 在線發(fā)布日期: 2024-06-20
  • 出版日期: 2024-06-17