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The microstructure evolution and the kinetics of static recrystallization have been investigated in beryllium during annealing at 680 ℃-880 ℃ through the implementation of the isothermal compression test and the measurement of the recrystallized fraction by hardness. The beryllium was subjected to compression on an Instron 5582 testing machine under varying strain temperatures (250 ℃-450 ℃), strain rates (10-1 s-1 to 10-4 s-1), and true strains (16%-92%). The results show that decreasing the strain temperature and increasing the strain rate promotes the progress of beryllium recrystallization. As the strain is increased, the beryllium recrystallized grains exhibit refinement, and the recrystallization rate is accelerated. However, the effect of increasing the strain on improving the recrystallization rate of beryllium diminished when the strain was increased to more than 60%. Increasing the annealing temperature, the recrystallization rate of beryllium was significantly accelerated. In particular, when the annealing temperature is elevated from 750 ℃ to 780 ℃, the recrystallization rate of beryllium enhances dramatically. At 880 ℃, the time for beryllium to complete recrystallization is reduced to approximately five minutes. The static recrystallization activation energy of beryllium is 396.56 kJ/mol at 680 ℃-750 ℃, while it is only 72.93 kJ/mol at 780 ℃-880 ℃. A static recrystallization kinetic model of beryllium with a modified Avirami component n is constructed. The calculated values of the model are in good agreement with the experimental values, indicating that the model is capable of predicting the static recrystallized fraction of beryllium deformed at low temperatures (250 ℃-450 ℃) and meets the requirements of engineering applications.