IS進(jìn)行模擬求解,從而預(yù)測(cè)等溫凝固所需時(shí)間,并經(jīng)過(guò)實(shí)驗(yàn)驗(yàn)證了數(shù)學(xué)模型預(yù)測(cè)等溫凝固時(shí)間的準(zhǔn)確性。"/>

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GH5188高溫合金TLP接頭等溫凝固過(guò)程數(shù)值計(jì)算
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1.中國(guó)航空制造技術(shù)研究院 航空焊接與連接航空科技重點(diǎn)實(shí)驗(yàn)室;2.南昌航空大學(xué) 航空制造工程學(xué)院;3.浙江工業(yè)大學(xué) 化工機(jī)械設(shè)計(jì)研究所;4.哈爾濱工業(yè)大學(xué) 先進(jìn)焊接與連接國(guó)家重點(diǎn)實(shí)驗(yàn)室

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國(guó)防科技重大專項(xiàng)(J2019-Ⅶ-0012)；國(guó)家自然科學(xué)基金(52065048)；先進(jìn)焊接與連接國(guó)家重點(diǎn)實(shí)驗(yàn)室開(kāi)放課題研究基金(AWJ-22Z02)


Numerical Calculation of Isothermal Solidification Process of GH5188 High Temper-ature Alloy TLP Joints
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    摘要:

    TLP焊接過(guò)程中一個(gè)重要的參數(shù)是完全等溫凝固所需的時(shí)間,本研究選用自主研制的KCo10鈷基中間層進(jìn)行試驗(yàn),在1030 ℃、1050 ℃和1080 ℃(1303 K、1323 K和1353 K)的溫度下進(jìn)行了不同保溫時(shí)間的焊接。以共晶液相兩側(cè)的固溶體作為邊界,測(cè)量平均ASZ尺寸。通過(guò)測(cè)量ASZ的尺寸隨焊接時(shí)間的平方根變化的情況,采用數(shù)據(jù)擬合的方式得出ASZ尺寸與結(jié)合時(shí)間的線性關(guān)系,然后基于菲克第二定律的隨時(shí)間變化的擴(kuò)散方程建立等溫凝固過(guò)程的數(shù)學(xué)模型,對(duì)等溫凝固時(shí)間tIS進(jìn)行模擬求解,從而預(yù)測(cè)等溫凝固所需時(shí)間,并經(jīng)過(guò)實(shí)驗(yàn)驗(yàn)證了數(shù)學(xué)模型預(yù)測(cè)等溫凝固時(shí)間的準(zhǔn)確性。

    Abstract:

    An important parameter in the TLP welding process is the time required for complete isothermal solidification. In this study, KCo10 intermediate layer was mainly used for the tests, which were carried out at temperatures of 1030 ℃, 1050 ℃ and 1080 ℃ (1303 K, 1323 K and 1353 K) with different holding times. The average ASZ size was measured using the solid solution on both sides of the eutectic liquid phase as the boundary. By measuring the size of the ASZ with the square root of the variation of the welding time, data fitting was used to derive a linear relationship between the ASZ size and the bonding time, and then a mathematical model of the isothermal solidification process was established based on Fick"s second law of diffusion equation with time, and the isothermal solidification time tIS was simulated and solved so as to predict the approximate time required for isothermal solidification, and was experimentally verified The accuracy of the mathematical model in predicting the isothermal solidification time was verified experimentally.

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滕俊飛,伍大為,李家豪,周惠焱,周嘉禾,林鐵松,黃永德. GH5188高溫合金TLP接頭等溫凝固過(guò)程數(shù)值計(jì)算[J].稀有金屬材料與工程,2024,53(8):2217~2222.[tengjunfei, wudawei, lijiahao, zhouhuiyan, zhoujiahe, lintiesong, huangyongde. Numerical Calculation of Isothermal Solidification Process of GH5188 High Temper-ature Alloy TLP Joints[J]. Rare Metal Materials and Engineering,2024,53(8):2217~2222.]
DOI：10.12442/j. issn.1002-185X.20230380

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  • 收稿日期:2023-06-14
  • 最后修改日期:2023-08-02
  • 錄用日期:2023-08-24
  • 在線發(fā)布日期: 2024-08-20
  • 出版日期: 2024-08-08