3Sn金屬間化合物臨界層,在1000 ℃高溫加速Cu、Ni元素擴散。Cu-21Ni-5Sn合金在40%預冷變形下于470 ℃時效60 min充分調(diào)幅分解,基體中析出致密的與基體共格的DO22及L12有序固溶體,與α銅基體之間的取向關系為(-1-1-1 )Cu//(-2-20)DO22，(-200)Cu//(-310)L12。合金抗拉強度達到峰值916 MPa,彈性模量為135.4 GPa,合金導電率達到6.23% IACS。"/>

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高熔點差三元合金累積疊軋-擴散合金化制備工藝
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作者單位:

1.北京科技大學;2.北京材料基因工程高精尖創(chuàng)新中心 北京科技大學 北京 北京科技大學現(xiàn)代交通金屬材料與加工技術北京實驗室 北京科技大學 北京

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基金項目:

國家重點研發(fā)計劃(項目號2018YFA0707300),國家自然科學基金(項目號51904029、52127802)


High difference melting point of ternary alloy by accumulative roll bonding-diffusion alloying preparation process
Author:
Affiliation:

1.北京科技大學;2.Beijing Advanced Innovation Center for Materials Genome Engineering,University of Science and Technology Beijing,Beijing,ChinaBeijing Laboratory of Metallic Materials and Processing for Modern Transportation,University of Science and Technology Beijing,Beijing,China

Fund Project:

The National Key Technologies R&D Program of China, The National Natural Science Foundation of China

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    摘要:

    為解決高熔點差多元合金制備方法存在的元素偏析、合金性能受限、制備成本高等問題,提出了高熔點差組元合金的累積疊軋-擴散合金化制備新工藝。采用SEM、EDS、TEM、XRD和萬能試驗機表征了累積疊軋-擴散合金化Cu-21Ni-5Sn合金的組織和性能,研究了累積疊軋和階梯式擴散熱處理工藝對Cu-21Ni-5Sn合金成分均勻性的影響和機理,并揭示了后續(xù)時效制度對Cu-21Ni-5Sn合金性能的影響和機理。結(jié)果表明：通過累積疊軋7道次+650 ℃/5 h+1000 ℃/8 h階梯真空擴散熱處理工藝,制備出了元素誤差小于5%、成分均勻的Cu-21Ni-5Sn合金。采用累積疊軋實現(xiàn)減薄中間層、縮短擴散距離,增加晶界、位錯等原子擴散通道,低熔點Sn元素與Cu、Ni元素在650 ℃形成高熔點(Cu,Ni)3Sn金屬間化合物臨界層,在1000 ℃高溫加速Cu、Ni元素擴散。Cu-21Ni-5Sn合金在40%預冷變形下于470 ℃時效60 min充分調(diào)幅分解,基體中析出致密的與基體共格的DO22及L12有序固溶體,與α銅基體之間的取向關系為(-1-1-1 )Cu//(-2-20)DO22，(-200)Cu//(-310)L12。合金抗拉強度達到峰值916 MPa,彈性模量為135.4 GPa,合金導電率達到6.23% IACS。

    Abstract:

    In order to solve the problems of elemental segregation, limited properties and high cost in the preparation of high difference of multi-alloys melting point, a new process of accumulative roll bonding (ARB)-diffusion alloying (DA) has been developed. The properties of the ARB-DA Cu-21Ni-5Sn alloy were characterized by SEM, EDS, TEM, XRD and the universal testing machine. The effects and mechanisms of the ARB and step diffusion heat treatment processes on the compositional homogeneity of the Cu-21Ni-5Sn alloy were investigated, and the effects and mechanisms of the subsequent aging regime on the properties of the Cu-21Ni-5Sn alloy were revealed. The results show that Cu-21Ni-5Sn alloy with less than 5% elemental error and homogeneous composition was prepared by ARB 7 passes + 650 ℃/5 h + 1000 ℃/8 h step vacuum diffusion heat treatment process. The Cu-21Ni-5Sn alloy was aged at 470 ℃ for 60 min under 40% pre-cooling deformation for 60 min to fully spinodal decomposition. Dense DO22 and L12 ordered solid solution with matrix with α-Cu matrix was(-1-1-1 )Cu//(-2-20)DO22, (-200)Cu//(-310)L12. The alloy reached tensile strength of 925 MPa, a modulus of elasticity of 135.4 GPa, and an alloy conductivity of 6.23% IACS.

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王文靜,馮啟航,劉雪峰,涂英明.高熔點差三元合金累積疊軋-擴散合金化制備工藝[J].稀有金屬材料與工程,2023,52(8):2765~2774.[WANG Wenjing, FENG Qihang, LIU Xuefeng, TU Yingming. High difference melting point of ternary alloy by accumulative roll bonding-diffusion alloying preparation process[J]. Rare Metal Materials and Engineering,2023,52(8):2765~2774.]
DOI：10.12442/j. issn.1002-185X.20220994

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  • 收稿日期:2022-12-21
  • 最后修改日期:2023-02-21
  • 錄用日期:2023-03-13
  • 在線發(fā)布日期: 2023-08-28
  • 出版日期: 2023-08-24