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Inconel 718合金電子束熔覆稀釋率的數(shù)值仿真與實(shí)驗(yàn)
作者:
作者單位:

1.中國(guó)電子科技集團(tuán)公司 第三十研究所，四川 成都 611730;2.桂林電子科技大學(xué) 機(jī)電工程學(xué)院，廣西 桂林 541004

作者簡(jiǎn)介:

通訊作者:

中圖分類號(hào):

TG156.95

基金項(xiàng)目:

國(guó)家重大共性關(guān)鍵技術(shù)基金項(xiàng)目（2021YFB330104）


Numerical Simulation and Experiment of Dilution Ratio for Electron Beam Cladding of Inconel 718 Alloy
Author:
Affiliation:

1.The 30th Research Institute, China Electronics Technology Group Corporation, Chengdu 611730, China;2.School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

Fund Project:

National Major Generic Key Technology Fund Project (2021YFB330104)

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    摘要:

    基于Ansys軟件仿真電子束熔覆過程中的溫度場(chǎng)分布規(guī)律，估測(cè)熔覆層截面熔化深度、熔化寬度值，進(jìn)而通過仿真估測(cè)熔覆層稀釋率值的大小，隨后進(jìn)行電子束熔覆實(shí)驗(yàn)并計(jì)算稀釋率的實(shí)際值，對(duì)比模擬值與實(shí)際值的情況，確認(rèn)通過仿真可得出電子束熔覆的稀釋率值。測(cè)試熔覆后試樣的顯微硬度和典型試樣的耐磨性能，結(jié)果表明稀釋率值小的試樣，熔覆層的質(zhì)量更優(yōu)異。

    Abstract:

    Based on the distribution law of temperature field in the electron beam cladding process simulated by ANSYS software, the melting depth and melting width of the cross section of cladding layer were investigated, and then the dilution ratio of cladding layer was estimated through simulation. Afterwards, the electron beam cladding experiment was conducted to measure the actual dilution ratio. Through the comparison between simulated and experimental dilution ratios, it can be verified that the dilution ratio of electron beam cladding can be obtained by simulation. The microhardness and the wear resistance of specimen after cladding were investigated. Results show that the smaller the dilution ratio, the better the quality of the cladding layer.

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引用本文

徐珖韜,楊偉,劉海浪,彭治國(guó),劉建.Inconel 718合金電子束熔覆稀釋率的數(shù)值仿真與實(shí)驗(yàn)[J].稀有金屬材料與工程,2023,52(9):3047~3055.[Xu Guangtao, Yang Wei, Liu Hailang, Peng Zhiguo, Liu Jian. Numerical Simulation and Experiment of Dilution Ratio for Electron Beam Cladding of Inconel 718 Alloy[J]. Rare Metal Materials and Engineering,2023,52(9):3047~3055.]
DOI：10.12442/j. issn.1002-185X.20220961

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  • 收稿日期:2022-12-08
  • 最后修改日期:2023-03-27
  • 錄用日期:2023-04-07
  • 在線發(fā)布日期: 2023-09-22
  • 出版日期: 2023-09-21