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電子互連無鉛釬料及焊點蠕變行為研究進展
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1.廈門理工學院 材料科學與工程學院 廈門;2.天津大學 材料科學與工程學院 天津;3.重慶科技學院 冶金與材料工程學院 重慶;4.南昌大學;5.常州大學

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國家自然科學基金(52175288, 52165047, 51974198)、福建省“閩江學者”特聘教授項目、河南省特聘研究員項目和江蘇省自然科學基金(BK20211351, BK20210853)


Development of creep behavior of lead-free solders and solder joints in electronic interconnection
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1.School of Materials Science and Engineering,Xiamen University of Technology,Xiamen;2.School of Materials Science and Engineering,Tianjin University;3.School of Metallurgy and Materials Engineering,Chongqing University of Science Technology

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    摘要:

    針對近年來無鉛釬料及焊點的蠕變失效問題,綜合評述了蠕變變形行為及其在焊點可靠性評估中的應用。首先系統(tǒng)地介紹無鉛釬料的蠕變行為,探討含合金元素/顆粒無鉛釬料蠕變性能改性機理。其次評述焊點蠕變行為,探討焊點成分以及不同基板材料對焊點蠕變特性影響的研究進展。再次結(jié)合具體電子器件,采用有限元模擬,分析基于有限元的焊點蠕變響應及疲勞壽命預測,評估焊點可靠性。最后針對無鉛釬料及焊點蠕變行為的未來發(fā)展進行展望,分析其研究中存在的問題及解決辦法,為焊點可靠性進一步研究提供理論支撐。

    Abstract:

    For the creep behavior of lead-free solders and solder joints in recent years, the creep deformation behavior and its application in reliability of solder joint were reviewed. Firstly, the creep behavior of lead-free solders was systematically introduced, and the creep modification mechanism of lead-free solders bearing alloying elements or particles was discussed. Secondly, the creep behavior of solder joints was reviewed, and the research progress about the influence of solder joint composition and substrate materials on the creep behavior of solder joints was analyzed. Furthermore, for specific electronic devices, the creep response and fatigue life prediction of solder joints based on finite element method were analyzed by using finite element simulation, and the reliability of solder joints was evaluated. Finally, the future development of lead-free solder and solder joint creep behavior is prospected, and the existing problems and solutions are analyzed to provide theoretical support for further research on solder joint reliability.

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張 亮,韓永典,尹立孟,胡小武,孫 磊.電子互連無鉛釬料及焊點蠕變行為研究進展[J].稀有金屬材料與工程,2023,52(12):4307~4324.[Zhang Liang, Han Yong-dan, Yin Li-meng, Hu Xiao-wu, Sun Lei. Development of creep behavior of lead-free solders and solder joints in electronic interconnection[J]. Rare Metal Materials and Engineering,2023,52(12):4307~4324.]
DOI：10.12442/j. issn.1002-185X.20220810

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  • 收稿日期:2022-10-17
  • 最后修改日期:2023-01-11
  • 錄用日期:2023-02-14
  • 在線發(fā)布日期: 2023-12-29
  • 出版日期: 2023-12-22