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Sn基無(wú)鉛焊料的研究進(jìn)展
作者:
作者單位:

1.昆明理工大學(xué)材料科學(xué)與工程學(xué)院;2.云南錫業(yè)集團(tuán)(控股)有限責(zé)任公司

作者簡(jiǎn)介:

通訊作者:

中圖分類(lèi)號(hào):

TG425

基金項(xiàng)目:

云南省重大科技專(zhuān)項(xiàng) (202002AB080001, 202202AB080001), 云南省中青年學(xué)術(shù)和技術(shù)帶頭人后備人才項(xiàng)目 (202005AC160039), 云錫集團(tuán)科技項(xiàng)目(YT-2021-15).


Research Progress of Sn-based Lead-free Solder
Author:
Affiliation:

1.Faculty of Materials Science and Technology, Kunming University of Science and Technology;2.Yunnan Tin Group (Holding) Company Limited

Fund Project:

Yunnan Major Scientific and Technological Projects (202002AB080001, 202202AB080001), The Young and Middle-Aged Academic and Technical Leaders Reserve Talent Project (202005AC160039), The Science and Technology Project of Yunnan Tin Group (Holding) Company Limited (YT-2021-15).

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    摘要:

    隨著世界各國(guó)“限鉛令”的頒布，Sn基無(wú)鉛焊料被廣泛研究以代替?zhèn)鹘y(tǒng)Sn-Pb焊料。然而，近年來(lái)大規(guī)模集成電路及先進(jìn)電子封裝架構(gòu)的發(fā)展對(duì)無(wú)鉛焊料的性能提出了更高要求。本文介紹了Sn-Sb、Sn-Cu、Sn-Ag、Sn-Zn、Sn-Bi和Sn-In系等主要無(wú)鉛焊料體系的最新研究進(jìn)展，綜述了添加合金元素、稀土元素以及納米顆粒對(duì)焊料顯微組織、潤(rùn)濕性能、力學(xué)性能、耐蝕性能和接頭服役性能的影響。文章最后討論了高性能無(wú)鉛焊料的研發(fā)方向，提出了創(chuàng)新的研究理念及研究方法，為下一代釬焊材料的研發(fā)提供了參考。

    Abstract:

    With the promulgation of the "Pb Restriction Laws" in various countries around the world, Sn-based lead-free solders have been widely studied to replace traditional Sn-Pb solders. However, the development of large-scale integrated circuits and advanced electronic packaging architectures in recent years has placed higher demands on the performance of lead-free solders. This review paper introduced the latest research progress on the main lead-free solder systems such as Sn-Sb, Sn-Cu, Sn-Ag, Sn-Zn, Sn-Bi, and Sn-In systems. And the effects of adding microalloying elements, rare earth elements, and nanoparticles on the microstructure, wettability, mechanical properties, corrosion resistance, and service performance of solder were also reviewed. The main development trends of high-performance lead-free solder were discussed, and innovative research concepts and methods were proposed for the development of next-generation brazing materials.

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引用本文

溥存繼,李才巨,白海龍,張欣,郭紹雄,易健宏. Sn基無(wú)鉛焊料的研究進(jìn)展[J].稀有金屬材料與工程,2023,52(9):3302~3315.[Pu Cunji, Li Caiju, Bai Hailong, Zhang Xin, Guo Shaoxiong, Yi Jianhong. Research Progress of Sn-based Lead-free Solder[J]. Rare Metal Materials and Engineering,2023,52(9):3302~3315.]
DOI：10.12442/j. issn.1002-185X.20220685

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歷史
  • 收稿日期:2022-09-01
  • 最后修改日期:2022-10-30
  • 錄用日期:2022-11-10
  • 在線發(fā)布日期: 2023-09-25
  • 出版日期: 2023-09-21