6Sn5層的生長，等溫時效期間金屬間化合物（Cu6Sn5+Cu3Sn）的生長為擴散控制機制。焊接時形成的扇貝狀表面在時效時消失，這表明在垂直于界面方向上的生長機制變?yōu)榉€(wěn)定性增長，說明Ag3Sn有效降低了Cu6Sn5的生長動力。"/>

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Ag含量對Sn-20Bi-0.7Cu焊料中金屬間化合物形成與生長的影響
作者:
作者單位:

1.昆明理工大學 材料科學與工程學院，云南 昆明 650093;2.云南錫業(yè)錫材有限公司，云南 昆明 650217;3.云南錫業(yè)集團(控股)有限責任公司 研發(fā)中心，云南 昆明 650000;4.西南石油大學 工程學院，四川 南充 637001

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基金項目:

云南省高層次科技人才及創(chuàng)新團隊選拔專項 （202105AE160028）；云南省重大科技專項計劃新材料專項（202202AB080001）；


Effect of Ag Content on Formation and Growth of Inter-metallic Compounds in Sn-20Bi-0.7Cu Solder
Author:
Affiliation:

1.Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China;2.Tin Products Manufacturing Co., Ltd of YTCL, Kunming 650217, China;3.R&D Center, Yunnan Tin Group (Holding) Co., Ltd, Kunming 650000, China;4.School of Engineering, Southwest Petroleum University, Nanchong 637001, China

Fund Project:

Major Science and Technology Project in Yunnan Province-New Material Special Project (202105AE160028); Yunnan Province Transformation Research Institute Technology Development Research Project-Innovation Guidance and Technology Enterprise Cultivation Plan (202202AB080001);Fundamental Research and Applied Basic Research Enterprise Joint Project Between Yunnan Provincial Department of Science and Technology and Yunnan Tin Group (Holding) Company Limited (202101BC070001-010)

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    摘要:

    研究了Sn-20Bi-0.7Cu-xAg焊料凝固和時效過程中的物相生長動力學。通過實驗和數(shù)值分析相結(jié)合分析了Ag含量和時效條件對界面結(jié)構和生長的影響，實驗中對Sn-20Bi-0.7Cu分別添加了質(zhì)量分數(shù)0.1%、0.4%、0.7%、1.0%、1.5%的Ag。為驗證焊接接頭的服役可靠性，在85 ℃和85%的濕度條件下，將接頭放置0、10、30、50、100、200和500 h。采用掃描電鏡等設備分析時效過程中界面化合物的形貌、厚度和分布，分析了β-Sn的形核界面和取向。結(jié)果表明，焊料中Ag含量的增加可以抑制界面Cu6Sn5層的生長，等溫時效期間金屬間化合物（Cu6Sn5+Cu3Sn）的生長為擴散控制機制。焊接時形成的扇貝狀表面在時效時消失，這表明在垂直于界面方向上的生長機制變?yōu)榉€(wěn)定性增長，說明Ag3Sn有效降低了Cu6Sn5的生長動力。

    Abstract:

    The interfacial reactions and growth kinetics of Sn-20Bi-0.7Cu-xAg (x=0.1, 0.4, 0.7, 1.0, 1.5, wt%) were investigated during solid-state aging. The effects of chemical composition on the structure and the growth of interface under high temperature and high humidity conditions were studied experimentally and numerically. In order to determine the long-term reliability of the solder joints, thermal accelerated aging tests were performed for 0, 10, 30, 50, 100, 200 and 500 h under 85 °C and 85% relative humidity conditions. The surface morphology, thickness, and distribution of interface compounds were observed by scanning electron microscope. The nucleation surface and growth direction of β-Sn were clarified. The phases were determined at the interface and the alloy matrix. Results show that with increasing the Ag content, the growth of the Cu6Sn5 layer is suppressed. The growth kinetics of intermetallic compound (Cu6Sn5+Cu3Sn) remains a diffusion-controlled process during the isothermal aging. The scallop-type Cu6Sn5 phase disappears at later aging stages, suggesting that the growth mechanism changes to the steady growth in the direction perpendicular to the interface. Besides, the results reveal that Ag3Sn effectively slows down the growth kinetics of Cu6Sn5.

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陳東東,秦俊虎,甘有為,張欣,白海龍,趙玲彥,易健宏,嚴繼康.Ag含量對Sn-20Bi-0.7Cu焊料中金屬間化合物形成與生長的影響[J].稀有金屬材料與工程,2023,52(2):502~507.[Chen Dongdong, Qin Junhu, Gan Youwei, Zhang Xin, Bai Hailong, Zhao Lingyan, Yi Jianhong, Yan Jikang. Effect of Ag Content on Formation and Growth of Inter-metallic Compounds in Sn-20Bi-0.7Cu Solder[J]. Rare Metal Materials and Engineering,2023,52(2):502~507.]
DOI：10.12442/j. issn.1002-185X.20220645

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  • 收稿日期:2022-08-08
  • 最后修改日期:2022-10-26
  • 錄用日期:2022-11-09
  • 在線發(fā)布日期: 2023-03-03
  • 出版日期: 2023-02-28