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亞微米活化Mo-15Cu合金晶間反應機制
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1.哈爾濱理工大學 材料科學與工程學院,哈爾濱 150040;2.哈爾濱工程大學 智能科學與工程學院,哈爾濱 150006

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基金項目:

中央支持地方高校改革發(fā)展資金項目,項目名稱:脈沖電流作用下鎂基材料燒結/鍛造關鍵技術研究,項目編號:323210001;哈爾濱人才項目,項目名稱:鉬銅合金電觸頭熔滲工藝研究,項目編號:2015RAQXJ036


Intergranular Reaction Mechanism of Submicron-Activated Mo-15Cu Alloy
Author:
Affiliation:

1.School of Materials Science and Chemical Engineering, Harbin University of Science and Technology, Harbin 150040, China;2.College of Intelligent Systems Science and Engineering, Harbin Engineering University, Harbin 150006, China

Fund Project:

Project supported by the Reform and Development of Local Colleges and Universities of the Central Government of China (323210001); Project supported by the Harbin Talents of China (2015RAQXJ036)

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    摘要:

    為了研究具有亞微米組分的鉬銅粉末燒結時的晶間反應機制,采用亞微米活化層法制備了一種具備晶間反應層的鉬銅復合材料。采用X射線衍射儀(XRD)、掃描電鏡(SEM)、能譜儀(EDS)、透射電鏡(TEM)、高分辨透射電鏡(HRTEM),對Mo-15Cu合金組織形貌、連接和結構特征進行了表征。研究了亞微米活化層對鉬銅復合材料晶間反應的影響。結果表明,添加8%(質量分數(shù))亞微米粉,可形成厚度約0.5 μm納米活化層。Mo亞微米顆粒通過流動、擴散,改變晶間反應機制,形成了真正意義上的晶間反應層,厚度約為5 nm,實現(xiàn)了冶金結合。

    Abstract:

    In order to investigate the intergranular reaction mechanism during sintering of molybdenum-copper powders with submicron components, a Mo-15Cu composite with an intergranular reaction layer was prepared by a submicron-activated layer method. The histomorphology, connectivity and structural characteristics of Mo-15Cu alloy were characterized by X-ray diffracto-meter (XRD), scanning electron microscope (SEM), energy dispersive spectrometer (EDS), transmission electron microscope (TEM), and high-resolution transmission electron microscope (HRTEM). The effect of submicron-activated layers on the intergranular reaction of Mo-15Cu composites was investigated. The results show that the submicron-activated layer with a thickness of 0.5 μm is formed by adding 8wt% submicron powder. The submicron-sized Mo particles change the intergranular reaction mechanism through flow and diffusion, forming an intergranular reaction layer with a thickness of about 5 nm and achieving metallurgical bonding.

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王敬澤,尹佳慶,崔建文,常晶,于彥東,孫云龍.亞微米活化Mo-15Cu合金晶間反應機制[J].稀有金屬材料與工程,2023,52(2):448~453.[Wang Jingze, Yin Jiaqing, Cui Jianwen, Chang Jing, Yu Yandong, Sun Yunlong. Intergranular Reaction Mechanism of Submicron-Activated Mo-15Cu Alloy[J]. Rare Metal Materials and Engineering,2023,52(2):448~453.]
DOI:10.12442/j. issn.1002-185X.20220244

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  • 收稿日期:2022-03-23
  • 最后修改日期:2023-02-08
  • 錄用日期:2022-06-17
  • 在線發(fā)布日期: 2023-03-03
  • 出版日期: 2023-02-28