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鈦合金仿蓮房特征芯體夾層結(jié)構(gòu)釬焊組織與性能
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中國(guó)航空制造技術(shù)研究院 航空焊接與連接技術(shù)航空科技重點(diǎn)實(shí)驗(yàn)室

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TG454

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航空科學(xué)基金資助(項(xiàng)目號(hào)2017ZE25)


Brazing interface microstructure and mechanical properties of titanium sandwich structure with lotus seedpod-like core
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Aeronautical Key Laboratory for Welding and Joining Technologies,AVIC Manufacturing Technology Institute

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    摘要:

    針對(duì)TC4鈦合金仿蓮房特征芯體與面板釬焊工藝,采用TiZrCuNi釬料,開(kāi)展了釬焊工藝研究,并分析了主要釬焊工藝參數(shù)對(duì)釬焊界面組織和夾層結(jié)構(gòu)力學(xué)性能的影響。結(jié)果表明:釬焊溫度920℃,保溫時(shí)間90min時(shí), TC4鈦合金仿蓮房特征芯體夾層結(jié)構(gòu)釬焊后界面焊合率良好,界面顯微組織為均勻針狀α組織和界面金屬間化合物,夾層結(jié)構(gòu)平壓強(qiáng)度均值為15.14MPa。釬焊保溫時(shí)間對(duì)TC4鈦合金仿蓮房特征芯體釬焊界面顯微組織影響顯著,當(dāng)釬焊保溫時(shí)間較短時(shí)(15min),釬料熔化后,液態(tài)釬料中Cu和Ni元素與母材反應(yīng)時(shí)間較短,釬料中Cu和Ni向母材中的擴(kuò)散反應(yīng)不充分,釬縫區(qū)局部Cu和Ni元素富集導(dǎo)致Cu和Ni元素含量超過(guò)共晶成分點(diǎn),釬焊保溫結(jié)束后液態(tài)釬縫凝固時(shí)發(fā)生共晶反應(yīng),生成塊狀金屬間化合物,釬焊界面主要為含有塊狀金屬間化合物的凝固釬料組織和針狀α組織;隨著釬焊保溫時(shí)間的增加,液態(tài)釬料中Cu和Ni元素與母材反應(yīng)時(shí)間增加,釬料中Cu和Ni元素向母材中擴(kuò)散反應(yīng)深度顯著增加,從而Cu和Ni元素在液態(tài)釬料中的含量顯著降低,元素含量小于共晶成分點(diǎn),釬焊保溫結(jié)束后液態(tài)釬縫凝固時(shí)Cu和Ni元素固溶于β相中,避免大量塊狀金屬化合物生成,隨后β相向α相的固態(tài)相變時(shí),共析反應(yīng)生成針狀α相,在針狀α組織界面處生成金屬間化合物。釬焊時(shí)間保溫時(shí)間從15min升至90min時(shí),由于釬焊界面金屬間化合物減少,TC4鈦合金仿蓮房特征芯體夾層結(jié)構(gòu)的平壓強(qiáng)度逐漸增加。

    Abstract:

    TC4 titanium lotus-like core sandwich structure was brazed using TiZrCuNi brazing filler metal. Effect of brazing parameters on brazing interface microstructure and mechanical properties of titanium lotus-like core sandwich structure was investigated. Results show that titanium sandwich structure with excellent brazed quality is attained at the brazing temperature of 920 ℃ with the brazing time of 90 min. The microstructure of the brazing interface consists of acicular α structure and Ti-Cu intermetallic compounds, and the average flat compressive strength of the sandwich structure is 15.14mpa. When the brazing time is short (15min), the diffusion reaction time between Cu and Ni in the liquid solder and the base metal is short, and the diffusion reaction of Cu and Ni into the base metal is not sufficient. The enrichment of Cu and Ni in the brazing interface leads to the content of Cu and Ni exceeding the eutectic composition, which makes eutectic reaction occurred during the solidification process of liquid solder joint after brazing, and thus massive intermetallic compounds are formed. The brazing interface is mainly composed of solidified brazing filler metal containing massive intermetallic compounds and acicular α structure. With the increase of brazing time, the diffusion reaction time of Cu and Ni elements in liquid solder and base metal increases, and the diffusion reaction depth of Cu and Ni elements into base metal increases significantly. As a result, the content of Cu and Ni in the liquid solder decreases significantly, and the element content is less than the eutectic composition point. Cu and Ni are all dissolved in β phase during the solidification process of the liquid brazing seam. When the β phase changes to α phase, the acicular α phase is formed by eutectoid reaction, and intermetallic compound is formed at the interface of acicular α structure. When the brazing time increases from 15min to 90min, the flat compressive strength of TC4 titanium sandwich structure increases gradually due to the decrease of intermetallic compounds in the brazing interface.

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鄧云華,王文森,陶軍.鈦合金仿蓮房特征芯體夾層結(jié)構(gòu)釬焊組織與性能[J].稀有金屬材料與工程,2021,50(9):3218~3224.[Deng Yunhua, Wang Wensen, Tao Jun. Brazing interface microstructure and mechanical properties of titanium sandwich structure with lotus seedpod-like core[J]. Rare Metal Materials and Engineering,2021,50(9):3218~3224.]
DOI:10.12442/j. issn.1002-185X.20200764

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  • 收稿日期:2020-10-03
  • 最后修改日期:2021-01-17
  • 錄用日期:2021-02-03
  • 在線發(fā)布日期: 2021-09-27
  • 出版日期: 2021-09-24