6Sn5金屬間化合物,即釬料基體與錫鍍層形成良好的冶金結(jié)合;隨著熱浸鍍溫度的升高和時間的延長,CuPSn釬料的抗拉強度和顯微硬度均呈降低趨勢,抗拉強度的降低源于界面處產(chǎn)生的Cu6Sn5脆性化合物和孔洞,顯微硬度的降低源于熱浸鍍的去應力退火作用;Cu93P釬料表面熱浸鍍錫可降低釬料的熔化溫度,提高釬料的潤濕性,Cu93P釬料表面熱浸鍍5.20%(質(zhì)量分數(shù))錫之后,Cu88.16P6.64Sn5.20在純銅板上的潤濕鋪展面積比基體Cu93P釬料增加43.15%。"/>

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熱浸鍍錫銅磷釬料的性能
作者:
作者單位:

鄭州機械研究所有限公司 新型釬焊材料與技術(shù)國家重點實驗室,河南 鄭州 450001

作者簡介:

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中圖分類號:

TG454

基金項目:

鄭州市重大科技創(chuàng)新專項2019CXZX0065;中原科技創(chuàng)新領(lǐng)軍人才ZYQR20180030


Properties of Cu-P Brazing Filler Metal After Hot-Dip Tinning
Author:
Affiliation:

State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd, Zhengzhou 450001, China

Fund Project:

Science and Technology Major Project of Zhengzhou City (2019CXZX0065); Leading Talents of Science and Technology in Central Plains (ZYQR20180030)

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    摘要:

    以Cu93P釬料為基體,在其表面熱浸鍍錫,制備CuPSn釬料,采用掃描電鏡、萬能力學試驗機、顯微硬度計、差熱分析儀、箱式電阻爐和體視顯微鏡分析錫鍍層的界面形貌,釬料的抗拉強度、顯微硬度、熔化溫度和潤濕性。結(jié)果表明:在Cu93P釬料表面熱浸鍍錫過程中,液態(tài)錫與釬料發(fā)生了界面反應,生成Cu6Sn5金屬間化合物,即釬料基體與錫鍍層形成良好的冶金結(jié)合;隨著熱浸鍍溫度的升高和時間的延長,CuPSn釬料的抗拉強度和顯微硬度均呈降低趨勢,抗拉強度的降低源于界面處產(chǎn)生的Cu6Sn5脆性化合物和孔洞,顯微硬度的降低源于熱浸鍍的去應力退火作用;Cu93P釬料表面熱浸鍍錫可降低釬料的熔化溫度,提高釬料的潤濕性,Cu93P釬料表面熱浸鍍5.20%(質(zhì)量分數(shù))錫之后,Cu88.16P6.64Sn5.20在純銅板上的潤濕鋪展面積比基體Cu93P釬料增加43.15%。

    Abstract:

    The CuPSn brazing filler metal was prepared on the basis of Cu93P brazing filler metal by hot-dip tinning. The interface morphology of tin coating was observed by scanning electron microscope. The tensile strength, microhardness, melting temperature and wettability of the brazing filler metal were investigated by universal mechanical testing machine, micro-hardness tester, differential thermal analyzer, resistance furnace and stereomicroscope. The results indicate that the liquid tin reacts with the brazing filler metal to form Cu6Sn5 intermetallic compound during hot-dip tinning, which means that the brazing filler metal and tin coating form good metallurgical bonding. The tensile strength and microhardness of brazing filler metal decrease with the increase of hot-dipping temperature and time. The decrease of tensile strength is due to the formation of Cu6Sn5 brittle compound and pores at the interface, and the decrease of microhardness is due to the stress-relieving annealing effect of hot-dip. Hot-dip tinning can reduce the melting temperature and improve the wettability of the brazing filler metal. The wetting area of brazing filler metal increases by about 43.15% compared with that of the matrix when 5.20wt% tin is hot dipped in it, and the Cu88.16P6.64Sn5.20 brazing filler metal possesses a good wettability.

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引用本文

董博文,鐘素娟,裴夤崟,沈元勛,龍偉民.熱浸鍍錫銅磷釬料的性能[J].稀有金屬材料與工程,2021,50(10):3527~3531.[Dong Bowen, Zhong Sujuan, Pei Yinyin, Shen Yuanxun, Long Weimin. Properties of Cu-P Brazing Filler Metal After Hot-Dip Tinning[J]. Rare Metal Materials and Engineering,2021,50(10):3527~3531.]
DOI:10.12442/j. issn.1002-185X.20200629

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  • 收稿日期:2020-08-22
  • 最后修改日期:2020-09-24
  • 錄用日期:2020-10-15
  • 在線發(fā)布日期: 2021-10-28
  • 出版日期: 2021-10-25