oC熱循環(huán)過(guò)程中Sn-58Bi/Cu焊點(diǎn)的界面金屬間化合物(IMC)生長(zhǎng)行為的影響。研究結(jié)果表明：回流焊后,在Sn-58Bi/Cu焊點(diǎn)和Sn-58Bi-0.1Ti/Cu焊點(diǎn)的界面處都形成一層扇貝狀的Cu6Sn5 IMC層。在熱循環(huán)300次后,在Cu6Sn5/Cu界面處形成了一層Cu3Sn IMC。Sn-58Bi/Cu焊點(diǎn)和Sn-58Bi-0.1Ti/Cu焊點(diǎn)的IMC層厚度均和熱循環(huán)時(shí)間的平方根呈線(xiàn)性關(guān)系。但是,Sn-58Bi-0.1Ti/Cu焊點(diǎn)的IMC層厚度明顯低于Sn-58B/Cu焊點(diǎn),這表明納米Ti顆粒的添加能有效抑制熱循環(huán)過(guò)程中界面IMC的過(guò)度生長(zhǎng)。另外計(jì)算了這兩種焊點(diǎn)的IMC層擴(kuò)散系數(shù),結(jié)果發(fā)現(xiàn)Sn-58Bi-0.1Ti/Cu焊點(diǎn)的IMC層擴(kuò)散系數(shù)(整體IMC、Cu6Sn5和Cu3Sn IMC)明顯比Sn-58Bi/Cu焊點(diǎn)小,這在一定程度上解釋了Ti納米顆粒對(duì)界面IMC層的抑制作用。"/>

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熱循環(huán)對(duì)Sn58Bi(納米Ti)/Cu焊點(diǎn)界面與性能影響
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作者單位:

1.江蘇師范大學(xué) 機(jī)電工程學(xué)院;2.南京航空航天大學(xué) 直升機(jī)傳動(dòng)技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室;3.江蘇科技大學(xué)材料科學(xué)及工程學(xué)院;4.鄭州機(jī)械研究所 新型釬焊材料與技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室

作者簡(jiǎn)介:

通訊作者:

中圖分類(lèi)號(hào):

TG 425

基金項(xiàng)目:

國(guó)家自然科學(xué)基金資助項(xiàng)目(51475220)；先進(jìn)焊接與連接國(guó)家重點(diǎn)實(shí)驗(yàn)室開(kāi)放課題重點(diǎn)項(xiàng)目(AWJ-19Z04)；江蘇省“六大人才高峰”資助項(xiàng)目(XCL-022)


Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints
Author:
Affiliation:

School of Mechanical Electrical Engineering,Jiangsu Normal University

Fund Project:

the Key project of State Key Laboratory of Advanced Welding and Joining，Natural Science Foundation of China，Six talent peaks project in Jiangsu Province

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    摘要:

    為了改善Sn-58Bi低溫釬料的性能,通過(guò)在Sn-58Bi低溫釬料中添加質(zhì)量分?jǐn)?shù)為0.1%的納米Ti顆粒制備了Sn-58Bi-0.1Ti納米增強(qiáng)復(fù)合釬料。在本文中,研究了納米Ti顆粒的添加對(duì)-55～125 oC熱循環(huán)過(guò)程中Sn-58Bi/Cu焊點(diǎn)的界面金屬間化合物(IMC)生長(zhǎng)行為的影響。研究結(jié)果表明：回流焊后,在Sn-58Bi/Cu焊點(diǎn)和Sn-58Bi-0.1Ti/Cu焊點(diǎn)的界面處都形成一層扇貝狀的Cu6Sn5 IMC層。在熱循環(huán)300次后,在Cu6Sn5/Cu界面處形成了一層Cu3Sn IMC。Sn-58Bi/Cu焊點(diǎn)和Sn-58Bi-0.1Ti/Cu焊點(diǎn)的IMC層厚度均和熱循環(huán)時(shí)間的平方根呈線(xiàn)性關(guān)系。但是,Sn-58Bi-0.1Ti/Cu焊點(diǎn)的IMC層厚度明顯低于Sn-58B/Cu焊點(diǎn),這表明納米Ti顆粒的添加能有效抑制熱循環(huán)過(guò)程中界面IMC的過(guò)度生長(zhǎng)。另外計(jì)算了這兩種焊點(diǎn)的IMC層擴(kuò)散系數(shù),結(jié)果發(fā)現(xiàn)Sn-58Bi-0.1Ti/Cu焊點(diǎn)的IMC層擴(kuò)散系數(shù)(整體IMC、Cu6Sn5和Cu3Sn IMC)明顯比Sn-58Bi/Cu焊點(diǎn)小,這在一定程度上解釋了Ti納米顆粒對(duì)界面IMC層的抑制作用。

    Abstract:

    In order to improve the performance of Sn-58Bi lead-free solder, the Sn-58Bi-0.1Ti nanometer reinforced composite solder was prepared by incorporating 0.1% Ti nanoparticles into the Sn-58Bi solder. In this paper, the effect of adding Ti nanoparticles on the growth behavior of intermetallic compounds (IMC) in Sn-58Bi/Cu solder joints during thermal cycling was studied. The results showed that a scallop-like Cu6Sn5 IMC layer was formed at Sn-58Bi /Cu and Sn-58Bi-0.1Ti/Cu interface after reflow soldering. After 300 thermal cycles, a layer of Cu3Sn IMC was formed at the Cu6Sn5/Cu interface. The thickness of IMC layer of Sn-58Bi/Cu solder joint and Sn-58Bi-0.1Ti/Cu solder joint is proportional to the square of thermal cycling time. However, the IMC thickness of Sn-58Bi-0.1Ti/Cu solder joint is significantly lower than that of Sn-58B/Cu solder joint, which indicated that the addition of Ti nanoparticles can effectively inhibit the excessive growth of interfacial IMC during the thermal cycle process. In addition, the IMC layer diffusion coefficients of these two solder joints were calculated, and it was found that the diffusion coefficients of IMC layer in Sn-58Bi-0.1Ti/Cu solder joint (overall IMC, Cu6Sn5 and Cu3Sn IMC) were smaller than that of Sn-58Bi/Cu solder joint, which explained the inhibitory effect of Ti nanoparticles on the interface IMC layer to some extent.

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引用本文

姜楠,張亮,孫磊,王鳳江,龍偉民,鐘素娟.熱循環(huán)對(duì)Sn58Bi(納米Ti)/Cu焊點(diǎn)界面與性能影響[J].稀有金屬材料與工程,2021,50(1):327~332.[Jiang Nan, Zhang Liang, Sun Lei, Wang Fengjiang, Long Weimin, Zhong Sujuan. Effect of thermal cycling on interface and properties of Sn58Bi(nano Ti)/Cu solder joints[J]. Rare Metal Materials and Engineering,2021,50(1):327~332.]
DOI：10.12442/j. issn.1002-185X.20200075

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  • 收稿日期:2020-02-10
  • 最后修改日期:2020-04-18
  • 錄用日期:2020-04-26
  • 在線(xiàn)發(fā)布日期: 2021-02-05
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