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鍍料粒子脫靶方式對(duì)純鋁鍍層微觀組織的影響
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西安理工大學(xué)材料科學(xué)與工程學(xué)院 西安 710048

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國(guó)家自然No. 51571114資助


Effect of escape-target method of deposited particles on microstructure of pure aluminum coating
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    摘要:

    傳統(tǒng)磁控濺射的鍍料粒子碰撞濺射脫靶后具有較低的離化率和沉積動(dòng)能,致使制備的純金屬鍍層極易形成帶有微空隙的柱狀結(jié)構(gòu),降低了鍍層的致密性和膜基結(jié)合力。針對(duì)此問(wèn)題,在磁控濺射環(huán)境下將陰陽(yáng)極間的電流提升至氣體放電伏安特性曲線中的弧光放電過(guò)渡區(qū)時(shí),受靶面晶界和缺陷處電子逸出功低于晶粒內(nèi)的影響,靶面微區(qū)會(huì)形成電子逸出的自增強(qiáng)效應(yīng),并產(chǎn)生弧光放電現(xiàn)象。弧光放電使靶面微區(qū)熔融,該區(qū)域的鍍料粒子將以熔融噴濺的方式脫靶,憑借熔融噴濺的高產(chǎn)額特性提高鍍料粒子的碰撞離化率,為實(shí)現(xiàn)鍍層組織的調(diào)控打下基礎(chǔ)。實(shí)驗(yàn)結(jié)果發(fā)現(xiàn):本研究采用高頻振蕩脈沖電場(chǎng),在逐步提升靶電流的過(guò)程中,靶面的微觀形貌會(huì)由不規(guī)則的凹坑狀形貌逐漸轉(zhuǎn)變?yōu)閳A形熔坑和溝壑狀形貌,說(shuō)明鍍料粒子的脫靶方式由碰撞濺射逐漸轉(zhuǎn)變?yōu)槿廴趪姙R。靶電流為2A時(shí),鍍料粒子主要以碰撞濺射脫靶,制備的純Al鍍層呈現(xiàn)出典型的柱狀組織,而在柱狀組織間存在著微小間隙。靶電流增大至14A時(shí),鍍料粒子以熔融噴濺脫靶為主,大量離化的鍍料粒子可在基體偏壓電場(chǎng)下加速沉積,提高了鍍料粒子的擴(kuò)散能力,弱化了鍍層柱狀生長(zhǎng)的傾向,易使鍍層形成致密的組織。同時(shí),鍍層的沉積速率和膜基結(jié)合力也會(huì)有明顯提升。

    Abstract:

    :For traditional magnetron sputtering, the sputtered species possessed low kinetic energy and ionization rate, which give rise to the metal coating formed columnar structure with micro pores, the coating therefore has poor compactness and adhesion strength. Aiming at this problem, the electric current through the anode and cathode was adjusted into the arc discharge transition region between the glow region and arc region of the gas discharge voltammetry curve in plasma physics. The escape energy of electron at the grain boundary and defect of the target is lower than that inside the grain, then theself-enhancing effectof electron escape is formed in grain boundary which induces the arc discharge phenomenon. Arc discharge melts some micro regions of the target surface, the plating particles in these regions will leave the target in the form of melt splashing. The high yield of melt splashing can improve the collisional ionization rate of the plating particles, which establish a foundation for the control of the coating structure. Experimental results show that: In the case of high frequency oscillating pulsed electric field, when the target current was gradually increased, the micro-morphology of the target surface gradually changed from Irregular pit-like morphology to round pit and curved ravine morphology, indicating that the off-target mode of the plating material changed from collision sputtering to melt splashing. When the target current was 2A, the species left the target by means of collision sputtering. The microstructure of the aluminum coating presented typical columnar structure with voids. When the target current increased to 14A, the off-target mode of the target particles was mainly melt splashing, massive ionized plating particles were accelerated under the negative bias of substrate. These ions with high kinetic energy enhanced bulk diffusion and weakened the tendency for column growth,which helped the coating form a dense structure. At the same time, the adhesion and the deposition rate of the coating were also significantly improved.

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楊超,王戎,郝娟,王迪,蔣百靈.鍍料粒子脫靶方式對(duì)純鋁鍍層微觀組織的影響[J].稀有金屬材料與工程,2021,50(1):304~310.[YANG Chao, WANG Rong, HAO Juan, WANG Di, JIANG Bailing. Effect of escape-target method of deposited particles on microstructure of pure aluminum coating[J]. Rare Metal Materials and Engineering,2021,50(1):304~310.]
DOI:10.12442/j. issn.1002-185X.20200051

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  • 收稿日期:2020-01-19
  • 最后修改日期:2020-03-03
  • 錄用日期:2020-03-05
  • 在線發(fā)布日期: 2021-02-05
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