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Cu@Ag包覆粉體的SPS燒結(jié)及其致密機(jī)理研究
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武漢理工大學(xué)材料復(fù)合新技術(shù)國家重點(diǎn)實(shí)驗(yàn)室

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國家自然科學(xué)基金重點(diǎn)項(xiàng)目51932006，國家自然科學(xué)基金創(chuàng)新群體項(xiàng)目 51521001，聯(lián)合基金Grant No. 6141A02022255，湖北省技術(shù)創(chuàng)新專項(xiàng)重大項(xiàng)目 2019AFA176，”111“計(jì)劃


Study on SPS Sintering of Cu @ Ag Coated Powder and Its Dense Mechanism
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    摘要:

    采用化學(xué)鍍法制備Cu@Ag包覆粉體,并利用放電等離子燒結(jié)技術(shù)(SPS)對其進(jìn)行燒結(jié),利用掃描電子顯微鏡、透射電子顯微鏡研究包覆粉體、燒結(jié)樣品的微觀結(jié)構(gòu),對燒結(jié)樣品的物相,致密度及其致密化機(jī)理進(jìn)行表征與分析。結(jié)果表明,化學(xué)鍍法制備的Cu@Ag粉體表面存在高純的包覆層。在較低的燒結(jié)溫度下得到致密度高的Cu-Ag燒結(jié)塊體,溫度升高,Cu-Ag燒結(jié)塊體的致密度逐漸升高,550℃時(shí),致密度達(dá)到極大值96.76%。分析認(rèn)為,得益于Cu@Ag粉體的包覆結(jié)構(gòu),在低溫下,銅顆粒表面的納米銀的頸縮促進(jìn)了燒結(jié)；在高溫下,Cu、Ag間的固溶進(jìn)一步促進(jìn)了燒結(jié)。

    Abstract:

    Cu@Ag coated powder was prepared by electroless plating and sintered by spark plasma sintering technology (SPS). The scanning electron microscope and transmission electron microscope were used to study the microstructure of the coated powder and sintered samples. The phases and densities of the samples were characterized. The results showed that there is obvious coating on the surface of Cu@Ag powder prepared by electroless plating. By using SPS, a high-density Cu-Ag sintered block can be obtained. At 550 ° C, the density reached a maximum of 96.76%. At low temperatures, the necking of nano-silver promotes the sintering; at high temperatures, solid solution between Cu and Ag promotes sintering.

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羅國強(qiáng),呂時(shí)俊,李遠(yuǎn),胡家念,張建,孫一,沈強(qiáng). Cu@Ag包覆粉體的SPS燒結(jié)及其致密機(jī)理研究[J].稀有金屬材料與工程,2021,50(1):286~290.[Luo Guoqiang, LvShijun, Li Yuan, Hu Jianian, Zhang Jian, Sun Yi, Shen Qiang. Study on SPS Sintering of Cu @ Ag Coated Powder and Its Dense Mechanism[J]. Rare Metal Materials and Engineering,2021,50(1):286~290.]
DOI：10.12442/j. issn.1002-185X.20200039

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  • 收稿日期:2020-01-16
  • 最后修改日期:2020-03-03
  • 錄用日期:2020-03-05
  • 在線發(fā)布日期: 2021-02-05
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