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MeO-doped Ag/SnO2 electrical contact materials were prepared by mechanical alloying combined with cold pressing-sintering-hot pressing process with CuO and Fe2O3 as dopants. Microstructure and physical properities of the electrical contact materials with different dopant contents were characterized by means of X-ray diffractometry (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), metal conductivity tester, thermal conductivity meter and Hall Effect tester. The results showed that, the use of hot pressing process could significantly enhance the bonding strength between SnO2 particles and Ag matrix. Meanwhile, the single doping of CuO and Fe2O3 could improve the electrical performance and thermal conductivity of the MeO-doped Ag/SnO2 electrical contact material, respectively. When a co-doping of CuO and Fe2O3 was used, the Ag-11.5SnO2-0.3CuO-0.2Fe2O3 material presented the optimal electrical and thermal conductivity with electrical resistivity of 2.25μΩ·cm, hardness of 74.8 HV0.5, thermal diffusion coefficient of 111.4 mm2/s and thermal conductivity of 338.6 W/(m.K) at room temperature. A smaller wetting angle of 62.7° between Ag droplets and the (CuO,Fe2O3)-doped SnO2 powders was observed, indicating a better wettability, and the interfaces between SnO2 and Ag grains were well-combined with a lattice mismatch of 14.25% between SnO2 (200) and Ag (111).