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Be/CuCrZr高溫熱等靜壓擴散連接接頭組織演化及斷裂機理
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西北稀有金屬材料研究院寧夏有限公司 稀有金屬特種材料國家重點實驗室

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國家自然科學基金面上項目(項目號51474177)


Microstructure Evolution and Fracture Modes of Be/CuCrZr Joints by Hot Isostatics Pressing Bonding at High Temperature
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State Key Laboratory for Special Rare Metal Materials,Northwest Rare Metal Materials Research Institute

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The National Natural Science Foundation of China

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    摘要:

    利用電子探針微分析術(shù)研究了具有50 μm Ti中間層的Be/CuCrZr高溫（780℃ ~ 850 ℃），不同時間（0.5 h ~ 2 h）熱等靜壓擴散連接接頭組織演化過程及斷裂機理。結(jié)果表明：Be/Ti和Ti/CuCrZr界面反應擴散的產(chǎn)物和先后順序符合能量-通量法則；Be在Ti中的擴散速率大于Cu在Ti中的，但Be/Ti界面反應區(qū)形成高Be含量的Ti-Cu-Be三組元相脆性高，是接頭性能惡化的主要原因，而Be/CuCrZr界面反應區(qū)形成的低Be含量的Ti-Cu-Be三元相對接頭性能影響相對較小；HIP連接工藝參數(shù)對樣品接頭性能存在明顯影響，800 ℃/2 h/130 MPa連接接頭性能最佳，抗拉強度為122.8 MPa，界面結(jié)合良好無連接熱裂紋，斷裂為Be12Ti+Be10Ti混合金屬化合物層解理斷裂。

    Abstract:

    Microstructure evolution and fracture modes of Be/CuCrZr joints with 50μm Ti interlayer by hot isostatics pressing bonding at high temperature (780 ℃ ~ 850 ℃) and different time (0.5 h ~2 h) were studied by mean of EPMA. The results show that forming process of intermetallic compounds at Be/Ti and Ti/CuCrZr interfaces conformed to Flux-Energy law. The diffusion rate of Be in Ti is greater than that of Cu in Ti. But the Ti-Cu-Be ternary intermetallic compound with high Be content formed in the Be/Ti interface reaction zone is very brittleness, which caused the property deterioration of the Be/CuCrZr joint. By contrast, the Ti-Cu-Be ternary intermetallic compounds with low Be content formed in the Ti/CuCrZr interface reaction zone have relatively little influence on Be/CuCrZr joint properties. HIP conditions affected significantly on Be/CuCrZr joint properties. The Be/CuCrZr joint bonded by HIP under 800 ℃, 2 h and130 MPa provided with optimum properties, and tensile strength is up to 122.8 MPa. The joint exhibited the good bonding interface without hot cracks, and the fracture of the joint is caused by cleavage fracture of Be12Ti+Be10Ti mixed intermetallic compound layer.

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李峰,李志年,鐘景明,王戰(zhàn)宏,何力軍,許德美. Be/CuCrZr高溫熱等靜壓擴散連接接頭組織演化及斷裂機理[J].稀有金屬材料與工程,2019,48(10):3331~3339.[Li Feng, Li Zhinian, Zhong Jingming, Wang Zhanhong, He Lijun, Xu Demei. Microstructure Evolution and Fracture Modes of Be/CuCrZr Joints by Hot Isostatics Pressing Bonding at High Temperature[J]. Rare Metal Materials and Engineering,2019,48(10):3331~3339.]
DOI：10.12442/j. issn.1002-185X.20180505

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  • 收稿日期:2018-05-17
  • 最后修改日期:2018-07-26
  • 錄用日期:2018-07-27
  • 在線發(fā)布日期: 2019-11-01
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