1.青海電子材料產(chǎn)業(yè)發(fā)展有限公司;2.有研工程技術(shù)研究院有限公司 有色金屬材料制備加工國(guó)家重點(diǎn)實(shí)驗(yàn)室
國(guó)家重點(diǎn)研發(fā)計(jì)劃項(xiàng)目(項(xiàng)目號(hào)2016YFB0301300)
1.Qinghai Electronic Material Industry Development CO.Ltd;2.Qinghai Electronic Material Industry Development COLtd;3.State Key Laboratory of Nonferrous Metals and Processes,GRIMAT Engineering Institute Co Ltd
馬秀玲,李永貞,姚恩東,王武軍,解祥生,祁善龍,程 曦,李艷鋒,黃國(guó)杰,尹向前.不同厚度電解銅箔的組織與性能研究[J].稀有金屬材料與工程,2019,48(9):2905~2909.[Ma Xiuling, Li Yongzhen, Yao Endong, Wang Wujun, Xie Xiangsheng, Qi Shanlong, Cheng Xi, Li Yanfeng, Huang Guojie, Yin Xiangqian. Study on Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses[J]. Rare Metal Materials and Engineering,2019,48(9):2905~2909.]
DOI:10.12442/j. issn.1002-185X.20180301