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不同厚度電解銅箔的組織與性能研究
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1.青海電子材料產(chǎn)業(yè)發(fā)展有限公司;2.有研工程技術(shù)研究院有限公司 有色金屬材料制備加工國(guó)家重點(diǎn)實(shí)驗(yàn)室

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國(guó)家重點(diǎn)研發(fā)計(jì)劃項(xiàng)目(項(xiàng)目號(hào)2016YFB0301300)


Study on Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses
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1.Qinghai Electronic Material Industry Development CO.Ltd;2.Qinghai Electronic Material Industry Development COLtd;3.State Key Laboratory of Nonferrous Metals and Processes,GRIMAT Engineering Institute Co Ltd

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    摘要:

    通過調(diào)整電沉積時(shí)間,控制其它電解工藝參數(shù)恒定不變,制備了不同厚度的電解銅箔。利用SEM、XRD、EBSD、萬能試驗(yàn)機(jī)等研究了不同厚度電解銅箔表面形貌、織構(gòu)、尺寸效應(yīng)及斷裂機(jī)制對(duì)其拉伸性能的影響,結(jié)果表明,隨著電沉積時(shí)間的增加,銅箔厚度增加,銅箔表面顆粒增大,晶面取向由{111}、{220}、{311}等織構(gòu)逐漸演變?yōu)闉閧220}強(qiáng)擇優(yōu)取向。銅箔厚度小于18μm時(shí),極薄銅箔由于尺寸效應(yīng),抗拉強(qiáng)度和延伸率隨銅箔厚度增加而增加。銅箔厚度大于18μm時(shí),隨著銅箔厚度增加,晶粒尺寸變大和晶面取向的高擇優(yōu)程度會(huì)降低銅箔抗拉強(qiáng)度。

    Abstract:

    Electrolytic copper foils with different thicknesses were prepared by adjusting the electrodeposition time and controlling the parameters of other electrolytic processes. Using SEM, XRD, EBSD, and Universal testing machine to research the effects of surface morphology, texture, size effect and fracture mechanism on the tensile properties of electrolytic copper foil with different thicknesses. The results show that with the progress of electrodeposition, the grain size of the surface increases, and the orientation of the crystal plane {220} becomes stronger. When the copper foil thickness is less than 18 μm, the tensile strength and elongation of the ultra-thin copper foils increase with the thickness of the copper foil due to the size effect.However, when the thickness of the copper foil is more than 18 μm, as the thickness of the copper foil increases, the grain size becomes larger and the degree of crystal plane orientation becomes higher, which reduces the tensile strength of the copper foil. Key words: Electrolytic copper foil; texture; mechanical properties; size effect

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馬秀玲,李永貞,姚恩東,王武軍,解祥生,祁善龍,程 曦,李艷鋒,黃國(guó)杰,尹向前.不同厚度電解銅箔的組織與性能研究[J].稀有金屬材料與工程,2019,48(9):2905~2909.[Ma Xiuling, Li Yongzhen, Yao Endong, Wang Wujun, Xie Xiangsheng, Qi Shanlong, Cheng Xi, Li Yanfeng, Huang Guojie, Yin Xiangqian. Study on Microstructure and Properties of Electrolytic Copper Foil with Different Thicknesses[J]. Rare Metal Materials and Engineering,2019,48(9):2905~2909.]
DOI:10.12442/j. issn.1002-185X.20180301

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  • 收稿日期:2018-03-30
  • 最后修改日期:2018-04-19
  • 錄用日期:2018-04-26
  • 在線發(fā)布日期: 2019-10-09
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