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基體脈沖偏壓對TiN/Cu納米復合薄膜組織結構、力學及耐磨性能的影響
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1.中國科學院金屬研究所專用材料與器件研究部;2.深圳職業(yè)技術學院;3.俄羅斯科學院西伯利亞分院強流電子研究所

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TB43

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國家自然科學基金項目（面上項目，重點項目，重大項目）


Effect of substrate pulse bias voltage on the microstructure and mechanical and wear-resistant properties of TiN/Cu nanocomposite films
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1.Institute of Metal Research,Chinese Academy of Sciences;2.School of Mechanical and Electrical Engineering,Shenzhen Polytechnic;3.Institute of High Current Electronics,Siberian branch,Russian Academy of Sciences,Akademicheskii pr /

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    摘要:

    本文采用軸向磁場增強電弧離子鍍在高速鋼基體上沉積了TiN/Cu納米復合薄膜,研究了基體脈沖偏壓幅值對薄膜成分、結構、力學性能及耐磨性能的影響。結果表明,薄膜中銅含量隨著脈沖偏壓幅值的增加先增加而后降低,在一個較低的范圍內(1.3-2.1at.%)。X射線衍射結果表明所有的薄膜均出現(xiàn)TiN相,并未觀察到Cu相。薄膜的擇優(yōu)取向隨著脈沖偏壓幅值的增加而改變。薄膜的最高硬度為36GPa,是在脈沖偏壓幅值為-200V時得到的,對應了1.6at.%的Cu含量。與純的TiN薄膜相比,Cu的添加明顯增強了薄膜的耐磨性能。

    Abstract:

    In this present work, TiN/Cu nanocomposite films were deposited by axial magnetic field-enhanced arc ion plating (AMFE-AIP) on high-speed steel (HSS) substrates, and the effect of substrate bias voltage on the chemical composition, microstructure, mechanical and tribological properties of the films were investigated by X-ray photoelectrons spectroscopy (XPS), X-ray diffraction (XRD), nanoindentation and wear measurements, respectively. The results showed that Cu content firstly increases and then decreases with the increase of the pulse bias voltage, being a low value in the range of 1.3 to 2.1 at.%. The XRD results showed all the films only appear TiN phase and no Cu phase is observed. And the preferred orientation for the films changes significantly with increasing the pulse bias voltage. The maximum value of hardness, 36 GPa is obtained with pulse bias voltage of -200V corresponding to the film containing approximately 1.6 at.% Cu. Compared to pure TiN film, Cu addition to TiN films significantly improves the wear resistance.

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趙彥輝,趙升升,任玲,V. V. Denisov, N. N. Koval,楊柯,于寶海.基體脈沖偏壓對TiN/Cu納米復合薄膜組織結構、力學及耐磨性能的影響[J].稀有金屬材料與工程,2018,47(11):3284~3288.[Yanhui Zhao, Shengsheng Zhao, Ling Ren, V. V. Denisov, N. N. Koval, Ke Yang, Baohai Yu. Effect of substrate pulse bias voltage on the microstructure and mechanical and wear-resistant properties of TiN/Cu nanocomposite films[J]. Rare Metal Materials and Engineering,2018,47(11):3284~3288.]
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  • 收稿日期:2017-04-19
  • 最后修改日期:2017-08-21
  • 錄用日期:2017-09-11
  • 在線發(fā)布日期: 2018-12-19
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