最新色国产精品精品视频,中文字幕日韩一区二区不卡,亚洲有码转帖,夜夜躁日日躁狠狠久久av,中国凸偷窥xxxx自由视频

+高級(jí)檢索
93W/Ni/Mo1接頭的等離子活化擴(kuò)散焊接研究
DOI:
作者:
作者單位:

武漢理工大學(xué),材料復(fù)合新技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室

作者簡(jiǎn)介:

通訊作者:

中圖分類號(hào):

TG146.2.3

基金項(xiàng)目:

國(guó)家自然科學(xué)基金(51572208和51521001)、湖北省自然基金創(chuàng)新群體項(xiàng)目(2016CFA006)、111計(jì)劃(B13035)和聯(lián)合基金(項(xiàng)目號(hào):6141A02022209)資助


Interfacial Microstructure and Mechanical Properties of 93W/Ni/Mo1 Joints by Plasma Activated Diffusion Bonding
Author:
Affiliation:

State Key Laboratory of Advanced Technology for Materials Synthesis and Processin,Wuhan University of Technology

Fund Project:

National Natural Science Foundation of China (Grant No. 51572208 and 51521001), the Nature Science Foundation of Hubei Province(2016CFA006), the 111 Project (B13035) and Joint Fund (Grant No. 201622JJ01)

  • 摘要
  • |
  • 圖/表
  • |
  • 訪問(wèn)統(tǒng)計(jì)
  • |
  • 參考文獻(xiàn)
  • |
  • 相似文獻(xiàn)
  • |
  • 引證文獻(xiàn)
  • |
  • 資源附件
  • |
  • 文章評(píng)論
    摘要:

    利用等離子活化技術(shù)對(duì)93W/Ni/Mo1進(jìn)行真空擴(kuò)散焊接,用剪切強(qiáng)度和顯微硬度表征焊接接頭的力學(xué)性能,對(duì)焊接界面和接頭斷口物相及微觀結(jié)構(gòu)進(jìn)行表征分析。結(jié)果表明,焊接溫度低于800℃時(shí),焊接界面有孔洞,焊接溫度高于800℃時(shí),焊接界面良好。焊接接頭的剪切強(qiáng)度隨著焊接溫度的升高先升高后降低,在焊接溫度為800℃時(shí)接頭強(qiáng)度最大為100.2 MPa。焊接溫度低于800℃時(shí),焊接界面發(fā)生擴(kuò)散形成固溶體;焊接溫度高于800℃時(shí),Ni/Mo1界面生成MoNi高硬度金屬間化合物,降低焊接接頭結(jié)合強(qiáng)度。93W/Ni/Mo1焊接接頭的斷裂破壞主要發(fā)生在Ni/Mo1擴(kuò)散界面。

    Abstract:

    Refractory metals 93W and Mo1 were bonded with Ni interlayer by plasma activated sintering. Investigations were mainly focused on the influence of bonding temperatures on the microstructures, elemental distributions across the interfaces and mechanical properties of 93W and Mo1 joints. And fracture mechnism of joints was also analyzed. Reliable bonded joints 93W/Ni/Mo1 were obtained when bonding temperature was above 800℃. Shear strength of 93W/Ni/Mo1 joints firstly increased (650~850℃) and then decreased (800~1000℃) with the rising of bonding temperature, and the maximum strength (100.2 MPa) of joint was obtained at 800℃. Soild solutions were formed at the 93W/Ni and Ni/Mo1 interfaces when bonding temperature was below 800℃, while MoNi brittle phase was emerged at Ni/Mo1 interface which debased the strength of joints. Fracture failure mainly occurs at Ni/Mo diffusion interfaces.

    參考文獻(xiàn)
    相似文獻(xiàn)
    引證文獻(xiàn)
引用本文

饒梅,羅國(guó)強(qiáng),張建,王傳彬,沈強(qiáng),張聯(lián)盟.93W/Ni/Mo1接頭的等離子活化擴(kuò)散焊接研究[J].稀有金屬材料與工程,2018,47(11):3536~3541.[Mei Rao, Guoqiang Luo, Jian Zhang, Chuanbin Wang, Qiang Shen, Lianmeng Zhang. Interfacial Microstructure and Mechanical Properties of 93W/Ni/Mo1 Joints by Plasma Activated Diffusion Bonding[J]. Rare Metal Materials and Engineering,2018,47(11):3536~3541.]
DOI:[doi]

復(fù)制
文章指標(biāo)
  • 點(diǎn)擊次數(shù):
  • 下載次數(shù):
  • HTML閱讀次數(shù):
  • 引用次數(shù):
歷史
  • 收稿日期:2017-03-10
  • 最后修改日期:2017-06-02
  • 錄用日期:2017-06-23
  • 在線發(fā)布日期: 2018-12-19
  • 出版日期: