6Sn5金屬間化合物并促使其均勻分布從而明顯提高SAC-Ga釬料的蠕變強(qiáng)度；與SAC-Ga-0.06Pr釬料相比,SAC-Ga-0.5Pr由于過量稀土Pr的表面氧化而導(dǎo)致其蠕變強(qiáng)度有所下降。此外,本文采用Dorn模型研究了含Pr的SAC-Ga釬料的室溫蠕變行為并計(jì)算了對(duì)應(yīng)的釬料蠕變應(yīng)力指數(shù)n；闡明了Pr對(duì)SAC-Ga釬料蠕變強(qiáng)度的強(qiáng)化機(jī)理,即當(dāng)位錯(cuò)遇到細(xì)小且均勻分布的Cu6Sn5 金屬間化合物時(shí),位錯(cuò)移動(dòng)只能采用繞過機(jī)制,從而提高了含Pr低銀釬料的抗蠕變性能。"/>

最新色国产精品精品视频,中文字幕日韩一区二区不卡,亚洲有码转帖,夜夜躁日日躁狠狠久久av,中国凸偷窥xxxx自由视频

+高級(jí)檢索
稀土Pr對(duì)低銀Sn-0.3Ag-0.7Cu-0.5Ga釬料蠕變行為影響的研究
DOI:
作者:
作者單位:

南京航空航天大學(xué)材料科學(xué)與技術(shù)學(xué)院,南京航空航天大學(xué)材料科學(xué)與技術(shù)學(xué)院,江蘇科技大學(xué)先進(jìn)焊接技術(shù)省級(jí)重點(diǎn)實(shí)驗(yàn)室,鄭州機(jī)械研究所新型釬焊材料與技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室,鄭州機(jī)械研究所新型釬焊材料與技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室

作者簡(jiǎn)介:

通訊作者:

中圖分類號(hào):

基金項(xiàng)目:


Study on creep behavior of Sn-0.3Ag-0.7Cu-0.5Ga low-Ag solder alloys bearing Pr
Author:
Affiliation:

College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Jiangsu Provincial Key Laboratory of Advanced Welding Technology,Jiangsu University of Science and Technology,State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering,State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering

Fund Project:

  • 摘要
    • |
  • 圖/表
    • |
  • 訪問統(tǒng)計(jì)
    • |
  • 參考文獻(xiàn)
    • |
  • 相似文獻(xiàn)
    • |
  • 引證文獻(xiàn)
    • |
  • 資源附件
    • |
  • 文章評(píng)論
    摘要:

    為進(jìn)一步促進(jìn)電子封裝用低銀無鉛釬料的發(fā)展,本文采用納米壓痕法研究了新型含Pr低銀Sn-0.3Ag-0.7Cu-0.5Ga (SAC-Ga)釬料顯微組織與蠕變性能之間的關(guān)系。結(jié)果表明,SAC-Ga、SAC-Ga-0.06Pr、SAC-Ga-0.5Pr三種釬料的蠕變位移分別為1717 nm、1144 nm、1472 nm；稀土Pr可通過細(xì)化Cu6Sn5金屬間化合物并促使其均勻分布從而明顯提高SAC-Ga釬料的蠕變強(qiáng)度；與SAC-Ga-0.06Pr釬料相比,SAC-Ga-0.5Pr由于過量稀土Pr的表面氧化而導(dǎo)致其蠕變強(qiáng)度有所下降。此外,本文采用Dorn模型研究了含Pr的SAC-Ga釬料的室溫蠕變行為并計(jì)算了對(duì)應(yīng)的釬料蠕變應(yīng)力指數(shù)n；闡明了Pr對(duì)SAC-Ga釬料蠕變強(qiáng)度的強(qiáng)化機(jī)理,即當(dāng)位錯(cuò)遇到細(xì)小且均勻分布的Cu6Sn5 金屬間化合物時(shí),位錯(cuò)移動(dòng)只能采用繞過機(jī)制,從而提高了含Pr低銀釬料的抗蠕變性能。

    Abstract:

    For development of low-Ag lead free solder alloys for microelectronic packaging, the correlation of creep properties with microstructure of novel Sn-0.3Ag-0.7Cu-0.5Ga (SAC-Ga) solder alloys bearing Pr has been investigated using nanoindentation. The results show that the creep deformation of SAC-Ga, SAC-Ga-0.06Pr, SAC-Ga-0.5Pr is 1717 nm, 1144 nm,1472 nm, respectively, which indicates that Pr addition could significantly enhance the creep resistance of SAC-Ga solders due to the refinement and more uniform distribution of Cu6Sn5 intermetallic compounds (IMCs). However, compared with the SAC-Ga-0.06Pr solder alloy, the SAC-Ga-0.5Pr alloy shows lower creep resistance which is mainly attributable to the surface oxidation of excess rare earth Pr. In addition, Dorn model has been used to describe the creep behavior and to obtain stress exponents of the SAC-Ga solder alloys bearing Pr. It is proposed that strengthening mechanism of creep resistance in SAC-Ga solder alloys bearing Pr is that when encountering refined and well-distributed Cu6Sn5 IMCs, a dislocation line cannot climb through the IMCs but bypass the IMCs, leading to a decrease in the creep deformation of the solder alloys bearing Pr.

    參考文獻(xiàn)
    相似文獻(xiàn)
    引證文獻(xiàn)
引用本文

王 博,薛松柏,王儉辛,龍偉民,張青科.稀土Pr對(duì)低銀Sn-0.3Ag-0.7Cu-0.5Ga釬料蠕變行為影響的研究[J].稀有金屬材料與工程,2018,47(9):2657~2662.[Wang Bo, Xue Songbai, Wang Jianxin, Long Weimin, Zhang Qingke. Study on creep behavior of Sn-0.3Ag-0.7Cu-0.5Ga low-Ag solder alloys bearing Pr[J]. Rare Metal Materials and Engineering,2018,47(9):2657~2662.]
DOI：[doi]

復(fù)制
文章指標(biāo)
  • 點(diǎn)擊次數(shù):
  • 下載次數(shù):
  • HTML閱讀次數(shù):
  • 引用次數(shù):
歷史
  • 收稿日期:2017-02-10
  • 最后修改日期:2017-03-02
  • 錄用日期:2017-03-15
  • 在線發(fā)布日期: 2018-11-01
  • 出版日期: