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放電等離子燒結(jié)法和熱壓法制備的鍍鈦金剛石/銅多層復(fù)合材料的結(jié)構(gòu)和熱性能
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作者單位:

北京科技大學(xué) 材料科學(xué)與工程學(xué)院,北京科技大學(xué) 材料科學(xué)與工程學(xué)院,北京科技大學(xué) 材料科學(xué)與工程學(xué)院,天津市鼎誠(chéng)鋁壓鑄件有限公司,天津市鼎誠(chéng)鋁壓鑄件有限公司

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中圖分類(lèi)號(hào):

基金項(xiàng)目:

國(guó)家自然科學(xué)基金項(xiàng)目（Nos. 51174028, 51541406）


Structure and thermal properties of layered Ti-clad diamond/Cu composites prepared by SPS and HP
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Affiliation:

School of Materials Science and Engineering,University of Science and Technology Beijing,School of Materials Science and Engineering,University of Science and Technology Beijing,School of Materials Science and Engineering,University of Science and Technology Beijing,Tianjin Dingcheng Aluminum Die Castings Company,Tianjin Dingcheng Aluminum Die Castings Company

Fund Project:

The National Natural Science Foundation of China (Nos. 51174028, 51541406)

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    摘要:

    用于電子封裝領(lǐng)域的多層鍍鈦金剛石/銅復(fù)合材料通過(guò)放電等離子燒結(jié)技術(shù)(SPS)和熱壓法(HP)分別制備獲得。通過(guò)掃描電子顯微鏡(SEM)確認(rèn)了復(fù)合材料的結(jié)構(gòu),同時(shí)熱導(dǎo)率(TC)和熱膨脹系數(shù)(CTE)等熱性能參數(shù)也進(jìn)行了分析。層狀復(fù)合材料的熱導(dǎo)率理論值參考改良的哈塞爾曼-約翰遜(HJ)模型,同時(shí)考慮TiC界面的影響計(jì)算,結(jié)果為446.66 W?m-1K-1,而熱膨脹系數(shù)則通過(guò)熱膨脹儀測(cè)試確定。結(jié)果顯示,經(jīng)放電等離子燒結(jié)的試樣與經(jīng)熱壓制備的試樣相比,缺陷相對(duì)較少,界面的結(jié)合對(duì)于復(fù)合材料熱導(dǎo)率的影響十分明顯。本文提出了一個(gè)界面影響的模型示意圖,熱導(dǎo)率隨著碳化物層的厚度增加和氣孔的出現(xiàn)而減小。由此可見(jiàn),實(shí)現(xiàn)高熱導(dǎo)率的條件是復(fù)合材料中的碳化物層較薄同時(shí)沒(méi)有氣孔的出現(xiàn)。

    Abstract:

    Layered Ti-clad diamond/Cu composites used in electronic packaging were prepared by spark plasma sintering (SPS) and hot pressing (HP), respectively. The structure was determined by Scanning Electron Microscopy (SEM) and the thermal properties, including the thermal conductivity (TC) and the coefficient of thermal expansion (CTE) were analyzed. The theoretical TC of the layered composites (446.66 W.m-1K-1) was calculated by the modified Hasselman and Johnson (HJ) model considering the influence of the TiC interface and the CTE was determined by dilatometer. The results show that the sample of SPS has fewer defects than that of HP and the interfacial bonding affects the TC of the composites significantly. A schematic graph of the interface influences is proposed and the TC decreases with the increasing thickness of carbide layer and air pores. In this regard, the composites with a thin carbide layer and no air pores should be processed to achieve a high TC.

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王云龍,段凱悅,王開(kāi)坤,戴志剛,薛志紅.放電等離子燒結(jié)法和熱壓法制備的鍍鈦金剛石/銅多層復(fù)合材料的結(jié)構(gòu)和熱性能[J].稀有金屬材料與工程,2018,47(7):2011~2016.[Wang Yunlong, Duan Kaiyue, Wang Kaikun, Dai Zhigang, Xue Zhihong. Structure and thermal properties of layered Ti-clad diamond/Cu composites prepared by SPS and HP[J]. Rare Metal Materials and Engineering,2018,47(7):2011~2016.]
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  • 收稿日期:2016-11-30
  • 最后修改日期:2017-03-07
  • 錄用日期:2017-03-16
  • 在線發(fā)布日期: 2018-10-10
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