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無鈀鍍鎳碳纖維增強(qiáng)Sn-3.0Ag-0.5Cu復(fù)合釬料的制備
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河南科技大學(xué)材料科學(xué)與工程學(xué)院,河南科技大學(xué)材料科學(xué)與工程學(xué)院,河南科技大學(xué)材料科學(xué)與工程學(xué)院,河南科技大學(xué)材料科學(xué)與工程學(xué)院

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TG425

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國家自然科學(xué)基金,國家國際科技合作專項(xiàng)(2014DFR50820),河南省科技創(chuàng)新杰出人才計(jì)劃(154200510022),河南省創(chuàng)新型科技團(tuán)隊(duì),河南省


Fabrication of Palladium-Free Nickel-Coated Carbon Fiber Reinforced Sn-3.0Ag-0.5Cu Composite Solder
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College of Materials Science and Engineering,Henan University of Science and Technology,College of Materials Science and Engineering,Henan University of Science and Technology,College of Materials Science and Engineering,Henan University of Science and Technology,College of Materials Science and Engineering,Henan University of Science and Technology

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    摘要:

    采用化學(xué)鍍法在碳纖維表面制備無鈀鎳鍍層,用粉末冶金法制備了以鍍鎳碳纖維為增強(qiáng)相的Sn-3.0Ag-0.5Cu 復(fù)合釬料,借助于SEM、EDS、OM等檢測手段對其微觀組織進(jìn)行分析,研究鍍鎳碳纖維含量對復(fù)合釬料微觀組織和基本性能的影響。結(jié)果表明:鍍鎳碳纖維主要分布在復(fù)合釬料的晶界處;隨著復(fù)合釬料中鍍鎳碳纖維含量的增加,其彌散度逐漸降低,熔點(diǎn)變化不大;當(dāng)鍍鎳碳纖維含量大于1wt%時(shí),鍍鎳碳纖維在晶界處的團(tuán)聚現(xiàn)象嚴(yán)重,復(fù)合釬料的電阻率顯著升高。添加1wt%的鍍鎳碳纖維有助于減小液態(tài)復(fù)合釬料在助焊劑界面和Cu基板處的表面張力,降低釬料基體的電流密度,使得復(fù)合釬料的潤濕性提高,電阻率有所降低。

    Abstract:

    Palladium-free Nickel coating was deposited on the surface of carbon fibers by electroless plating method. Nickel coated carbon fibers reinforced Sn-3.0Ag-0.5Cu composite solder was made using the powder metallurgy technique. Microstructure of composite solder was observed and analyzed with the help of SEM, EDS and OM. The effect of Nickel coated carbon fibers contents on the microstructure and properties of composites solder was studied. The results showed that nickel plated carbon fiber was mainly distributed in the grain boundary of the composite solder. The dispersity of coated carbon fiber decreased with its content increasing, while the melting point of composite solder changed little. When the coated carbon fiber content was greater than 1wt%, the reinforced phase appeared obvious agglomeration, which led to the higher electrical resistivity. The added 1wt% coated carbon fiber will be helpful to decrease the surface tension of liquid composite solder between the flux and Copper substrate, which caused the excellent wetting effect. At the same time, the current density of solder matrix was decreased, which resulted in the lower electrical resistivity of composite solder.

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王悔改,張柯柯,霍福鵬,張萌.無鈀鍍鎳碳纖維增強(qiáng)Sn-3.0Ag-0.5Cu復(fù)合釬料的制備[J].稀有金屬材料與工程,2018,47(8):2573~2577.[Wang Huigai, Zhang Keke, Huo Fupeng, Zhang Meng. Fabrication of Palladium-Free Nickel-Coated Carbon Fiber Reinforced Sn-3.0Ag-0.5Cu Composite Solder[J]. Rare Metal Materials and Engineering,2018,47(8):2573~2577.]
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  • 收稿日期:2016-09-06
  • 最后修改日期:2016-11-07
  • 錄用日期:2016-12-02
  • 在線發(fā)布日期: 2018-10-17
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