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熱沖擊下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu釬焊接頭組織與性能
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河南科技大學(xué)材料科學(xué)與工程學(xué)院,河南科技大學(xué)材料科學(xué)與工程學(xué)院,河南科技大學(xué)材料科學(xué)與工程學(xué)院

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國(guó)家國(guó)際科技合作專項(xiàng)(2014DFR50820),河南省科技創(chuàng)新杰出人才計(jì)劃(154200510022),河南省創(chuàng)新型科技團(tuán)隊(duì),河南省高?？萍紕?chuàng)新團(tuán)隊(duì)計(jì)劃(13IRTSTHN003)


Interfacial Microstructure and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu Solder Joint under Thermal Shock
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College of Materials Science and Engineering,Henan University of Science and Technology,College of Materials Science and Engineering,Henan University of Science and Technology,College of Materials Science and Engineering,Henan University of Science and Technology

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    摘要:

    借助于SEM、EDS、XRD等檢測(cè)手段對(duì)Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu釬焊接頭進(jìn)行觀察分析,研究了釬焊工藝參數(shù)及熱沖擊條件對(duì)Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu釬焊接頭界面金屬間化合物和力學(xué)性能的影響。結(jié)果表明：添加0.05 wt% Ni能細(xì)化Sn2.5Ag0.7Cu0.1RE釬料合金的初生β-Sn相和共晶組織；釬焊溫度270 ℃和釬焊時(shí)間240 s時(shí),釬焊接頭剪切強(qiáng)度最大達(dá)26.9 MPa,較未添加Ni的釬焊接頭提高8.9%；隨著熱沖擊周期的增加,釬焊接頭界面金屬間化合物層平均厚度增加,界面粗糙度先增大后減小,釬焊接頭強(qiáng)度降低；添加0.05wt%Ni能夠抑制接頭界面金屬間化合物的成長(zhǎng)、釬焊接頭強(qiáng)度的降低,有利于改善接頭可靠性。

    Abstract:

    To study the effect of solder process parameters and thermal shock on Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu of soldered joints, the interface intermetallic compounds and strength of the joints were observed and analyzed with the help of SEM, EDS, XRD. The results showed that adding 0.05 wt% Ni can refine the primary β-Sn phase and eutectic of the Sn2.5Ag0.7Cu0.1RE solder alloy. The maximum shear strength was 26.9MPa, which obtained from the joint under the soldering temperature of 270℃ and soldering time of 240s. The maximum shear strength increased 8.9% than Sn2.5Ag0.7Cu0.1RE/Cu joint. The interface roughness, the average thickness of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu joint rased with the increasing of temperature and time. The shear strength of the joints increased and then decreased. The interface IMC of the solder joints irregular growth with the rasing of thermal shock cycle. At the same time, the strength of the joint was decreasing. The added 0.05 wt% Ni can inhibite the quick decrease of the reliability of soldered joint in the process of the thermal shock.

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張柯柯,郭興東,王悔改.熱沖擊下Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu釬焊接頭組織與性能[J].稀有金屬材料與工程,2017,46(5):1353~1358.[Zhang Keke, Guo Xingdong, Wang Huigai. Interfacial Microstructure and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu Solder Joint under Thermal Shock[J]. Rare Metal Materials and Engineering,2017,46(5):1353~1358.]
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  • 收稿日期:2016-05-30
  • 最后修改日期:2016-07-21
  • 錄用日期:2016-08-17
  • 在線發(fā)布日期: 2017-09-27
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