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RE及Ni對(duì)Zn20Sn高溫?zé)o鉛釬料顯微組織及性能的影響
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福州大學(xué)材料科學(xué)與工程學(xué)院,福州大學(xué)材料科學(xué)與工程學(xué)院

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TG425+.1

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福建省科技廳資助項(xiàng)目（2015H0008）


The Influence of RE and Ni on the Microstructure and Properties of Zn20Sn High-temperature Lead-Free Solder
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    摘要:

    在Zn20Sn高溫?zé)o鉛釬料合金中添加0.1wt.%RE及0.2~0.8wt.%Ni，研究了RE及Ni對(duì)釬料合金顯微組織及性能的影響。結(jié)果表明，在Zn20Sn中同時(shí)添加0.1wt.%RE及0.2~0.8wt.%Ni后，釬料合金的固相線變化不大，而液相線溫度降低；RE及Ni對(duì)釬料合金的潤濕性能及顯微硬度有明顯的影響，當(dāng)RE為0.1wt.%、Ni為0.4wt.%時(shí)，釬料合金的潤濕性能最好、顯微硬度最高；隨著RE及Ni的添加，在釬料合金中形成了含Ni金屬間化合物，且隨著Ni含量的提高，金屬間化合物的形狀、釬料合金的組織結(jié)構(gòu)發(fā)生顯著變化。

    Abstract:

    0.1wt.% RE and 0.2~0.8wt.% Ni were added into the Zn20Sn high-temperature lead-free solder. The effects of RE and Ni additions on the microstructure and properties of the solder alloys were investigated. The results show that the solidus temperature of solder alloys is not distinctly affected when the 0.1 wt.% RE and 0.2%~0.8wt.% Ni were added into Zn20Sn solder alloys, whereas the liquidus temperature is decreased, the wettability and microhardness are significantly improved. The solder alloy shows best wettability and highest microhardness when the content of RE is 0.1wt.% and Ni is 0.4wt.%. Ni-containing intermetallic compounds formed in solder alloys and the amount of intermetallic compounds gradually increaseed with increasing Ni content, and the shape of intermetallic compounds and the microstructure of solder alloys are significantly changed.

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李小軍,戴品強(qiáng). RE及Ni對(duì)Zn20Sn高溫?zé)o鉛釬料顯微組織及性能的影響[J].稀有金屬材料與工程,2018,47(6):1860~1865.[lixiaojun, Dai Pinqiang. The Influence of RE and Ni on the Microstructure and Properties of Zn20Sn High-temperature Lead-Free Solder[J]. Rare Metal Materials and Engineering,2018,47(6):1860~1865.]
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  • 收稿日期:2016-05-19
  • 最后修改日期:2016-07-01
  • 錄用日期:2016-07-15
  • 在線發(fā)布日期: 2018-09-06
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