9Al4；Cu顆粒內(nèi)距界面越遠(yuǎn)的區(qū)域，受溫度和應(yīng)力的影響越小，其變形主要是通過(guò)晶體內(nèi)位錯(cuò)增殖和移動(dòng)；沉積顆粒頂部，遠(yuǎn)離Cu/Al界面，幾乎不受應(yīng)力和溫度影響，保持原始顯微結(jié)構(gòu)。"/>

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冷噴涂單顆粒銅在鋁基體上的顯微結(jié)構(gòu)研究
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中國(guó)科學(xué)院金屬研究所,中國(guó)科學(xué)院金屬研究所,中國(guó)科學(xué)院金屬研究所,巴塞羅那大學(xué)熱噴涂中心CPT,加泰羅尼亞 巴塞羅那,巴塞羅那大學(xué)熱噴涂中心CPT,加泰羅尼亞 巴塞羅那,中國(guó)科學(xué)院金屬研究所

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國(guó)家自然科學(xué)基金資助(項(xiàng)目號(hào)No. 50971127和No. 50902131)


Microstructure Analysis of Copper Particle Deposited on Aluminum by Cold Spray
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    摘要:

    本文采用冷噴涂法在鋁(Al)基體上沉積單顆粒銅(Cu)，利用聚焦離子束/電子束(FIB/SEM)系統(tǒng)精確定位并原位制備了完整單個(gè)顆粒Cu沉積在Al基體上的透射樣品，分析其顯微結(jié)構(gòu)及形成原因。實(shí)驗(yàn)結(jié)果表明，撞擊過(guò)程中溫度與應(yīng)力分布不均勻，導(dǎo)致沉積Cu顆粒不均勻形變。Cu/Al界面受影響較大：顆粒動(dòng)能轉(zhuǎn)化為形變能和熱能，打破了界面處氧化膜，使界面附近溫度迅速升高，發(fā)生動(dòng)態(tài)再結(jié)晶，生成金屬間化合物Cu9Al4；Cu顆粒內(nèi)距界面越遠(yuǎn)的區(qū)域，受溫度和應(yīng)力的影響越小，其變形主要是通過(guò)晶體內(nèi)位錯(cuò)增殖和移動(dòng)；沉積顆粒頂部，遠(yuǎn)離Cu/Al界面，幾乎不受應(yīng)力和溫度影響，保持原始顯微結(jié)構(gòu)。

    Abstract:

    The aim of the paper is to explore the deformation mechanism of particles in cold spray. Focused ion beam/ scanning electronic microscopy (FIB/SEM) system was employed to prepare a TEM specimen of a whole copper particle on aluminum substrate on wipe test. Through analyzing the microstructure of the TEM sample, the result indicates inhomogeneous deformation of Cu particles is due to inhomogeneity of stress field and temperature. During the impact, the kinetic energy of particles transformed to deformation energy and heat, which led to alumina layer broken and the temperature increasing quickly. Because of high temperature and strain rate, re-crystallization has happened in Cu near the interface and intermetallic compound Cu9Al4 has been obtained on the interface. The farther the grains were from the interface, the less influence happened on them. Grains had few effect of heat or stress field on the location far away from the interface, especially on the top of particle.

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馬廣璐,孔令艷,李鐵藩,Nuria Cinca, Josep M. Guilemany,熊天英.冷噴涂單顆粒銅在鋁基體上的顯微結(jié)構(gòu)研究[J].稀有金屬材料與工程,2018,47(4):1166~1173.[MAGUANGLU, KONG LINGYAN, LI TIEFAN, Nuria Cinca, Josep M. Guilemany, XIONG TIANYING. Microstructure Analysis of Copper Particle Deposited on Aluminum by Cold Spray[J]. Rare Metal Materials and Engineering,2018,47(4):1166~1173.]
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  • 收稿日期:2016-03-09
  • 最后修改日期:2016-05-03
  • 錄用日期:2016-05-18
  • 在線發(fā)布日期: 2018-05-31
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