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This paper proposes a method to sintering tungsten-copper alloy coating layer to copper plate surface. Sintering in the hydrogen after pre-compacted tungsten-copper alloy powder to the surface of the copper plate, then compacte the powder by explosive sintering,diffusion sintering after explosive compaction.The compressing process of explosive compaction was simulated using the commercially available package AUTODYN.Numerical simulation indicates deformation of the coating layer and pressure distribution during the compressing process,ensure the parameters of experiment is well.Use these parameters we mke the coating layer up to 99.3% of the theoretical density.Microstructure characteristics indicate that tungsten copper powder well mixed.The size of the tungsten particles is larger than copper particles.The SEM fracture surface analysis is different from traditional fracture. Tungsten copper joint surface,analyzed by SEM,indicates that tungsten copper alloy sintered on the surface of the copper.