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Sn基無鉛釬料晶須生長(zhǎng)行為的研究
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教育部博士點(diǎn)學(xué)科專項(xiàng)科研基金（20101103110019）


Growth Behavior of Whiskers in Sn-Based Lead-Free Solders
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    摘要:

    研究了有機(jī)-無機(jī)籠形硅氧烷齊聚物（POSS）對(duì)Sn基無鉛釬料晶須生長(zhǎng)行為的影響。分別采用純Sn和Sn3.0Ag0.5Cu（SAC305）作為基體，加入3%（質(zhì)量分?jǐn)?shù)）的POSS硅三醇制備復(fù)合釬料。樣品在–45~85 ℃的高低溫循環(huán)條件下進(jìn)行晶須生長(zhǎng)加速實(shí)驗(yàn)，并觀察樣品表面及界面顯微組織的演變。結(jié)果表明，POSS可在加速條件下穩(wěn)定釬料基體，同時(shí)通過提高釬料的強(qiáng)度和硬度，來緩解釬料在熱循環(huán)應(yīng)力作用下產(chǎn)生的塑性形變，進(jìn)而有效抑制2種釬料的晶須生長(zhǎng)。

    Abstract:

    The effects of organic-inorganic cage-type polyhedral oligomeric silsesquioxane (POSS) on the whisker formation behavior of Sn-based lead-free solders were investigated. Pure Sn and Sn3.0Ag0.5Cu (SAC305) solders were used as solder matrix, and the composite solder was fabricated with 3 wt% POSS trisilanol addition. The samples were tested under thermal cycling to accelerate whisker growth, and the temperature range varied between –40 °C and 85 °C. The surficial evolution and interfacial microstructure were observed. The results indicate that POSS would stabilize solder matrix under thermal cycling condition. Meanwhile, the strength and microhardness of solders are improved by POSS significantly, which consequently reduce the deformations in the solders caused by deformations, and inhibit whisker formation eventually.

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劉思涵,馬立民,舒雨田,左 勇,郭 福. Sn基無鉛釬料晶須生長(zhǎng)行為的研究[J].稀有金屬材料與工程,2015,44(11):2868~2872.[Liu Sihan, Ma Limin, Shu Yutian, Zuo Yong, Guo Fu. Growth Behavior of Whiskers in Sn-Based Lead-Free Solders[J]. Rare Metal Materials and Engineering,2015,44(11):2868~2872.]
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  • 收稿日期:2014-11-15
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  • 在線發(fā)布日期: 2016-07-29
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