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W-Ni-Cu功能梯度材料的制備及性能研究
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北京工業(yè)大學(xué),北京工業(yè)大學(xué),華北理工大學(xué),華北理工大學(xué),華北理工大學(xué)

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國(guó)家自然科學(xué)基金資助項(xiàng)目(51274082);ITER計(jì)劃專項(xiàng)項(xiàng)目(2013GB109003)


Study on the preparation and properties of W-Ni-Cu functionally gradient materials
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North China University of Science and Technology,,,,

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    摘要:

    采用熔鹽電沉積與水溶液電沉積工藝制備了W-Ni-Cu復(fù)合材料。經(jīng)800 ℃依次保溫60 min、120 min、180 min退火后，可獲得梯度層厚度分別為25 μm、35 μm、45 μm的W-Ni-Cu梯度材料，其中Ni起到橋接W和Cu的作用。試樣經(jīng)熱沖擊和熱疲勞試驗(yàn)處理后，表面無突起、裂紋或脫落現(xiàn)象，說明鍍層與基體之間具有良好的冶金結(jié)合性能。導(dǎo)熱性試驗(yàn)表明，在25～800 ℃范圍內(nèi)，純W板和W-Ni-Cu梯度材料的導(dǎo)熱系數(shù)隨溫度升高而降低；相同溫度下，純W板的導(dǎo)熱系數(shù)比W-Ni-Cu梯度材料的導(dǎo)熱系數(shù)大，且W-Ni-Cu梯度材料的導(dǎo)熱系數(shù)隨梯度層厚度升高而降低。

    Abstract:

    W-Ni-Cu compound materials were?obtained?by?using?fused-salt?electrolysis?method?and?aqueous?solution?electrolysis?method. W-Ni-Cu?functional?graded?materials?(FGM)?characterized?with?different?thickness?(25 μm,?35 μm?and?45 μm) were obtained from its compound materials after annealing at?800 ℃ for?60min,?120min?and?180min, respectively, Ni plays a role in bridging Cu and W. Cracks and abscission were not presented?in?the?surface?of?samples?after?thermal?shock?and?thermal?fatigue,?which?indicates?the?material?has?good?bonding?properties. Thermal ?conductivity?tests?were?also?conducted,?the?result?shows?that?the?thermal?conductivity?of?pure?W?plate?and?W-Ni-Cu FGM decrease with increasing temperature (25～800 ℃). The thermal conductivity of pure W plate is higher than that of W-Ni-Cu FGM at the same temperature. The thermal conductivity of W-Ni-Cu FGM decreases with increasing gradient thickness.

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引用本文

齊艷飛,王波,周景一,李運(yùn)剛,田薇. W-Ni-Cu功能梯度材料的制備及性能研究[J].稀有金屬材料與工程,2017,46(12):3893~3896.[QI Yanfei, WANG Bo, ZHOU Jingyi, LI Yungang, TIAN Wei. Study on the preparation and properties of W-Ni-Cu functionally gradient materials[J]. Rare Metal Materials and Engineering,2017,46(12):3893~3896.]
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  • 收稿日期:2015-10-13
  • 最后修改日期:2016-03-16
  • 錄用日期:2016-03-29
  • 在線發(fā)布日期: 2018-01-04
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