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雙向脈沖參數(shù)對(duì)金鑄層的形貌和結(jié)構(gòu)影響
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中國(guó)地質(zhì)大學(xué)武漢,中國(guó)地質(zhì)大學(xué)武漢,中國(guó)地質(zhì)大學(xué)武漢,中國(guó)地質(zhì)大學(xué)武漢

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Influence of pulse parameters on the morphology and microstructure of gold electrodeposits
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China University of Geosciences Wuhan,China University of Geosciences Wuhan,China University of Geosciences Wuhan,China University of Geosciences Wuhan

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    摘要:

    本文采用雙脈沖電沉積技術(shù),控制單一變量,在酸性的無(wú)氰氯金酸溶液進(jìn)行金的電沉積。采用掃描電子顯微鏡、X 射線衍射儀研究了脈沖電流密度和占空比對(duì)金鑄層表面和橫截面形貌,及顯微結(jié)構(gòu)的影響。實(shí)驗(yàn)結(jié)果表明正向峰值電流密度從2.25 A/dm2增加到3.75A/dm2,鑄層晶粒細(xì)化,但正向電流密度過(guò)大導(dǎo)致表面起伏較大,鑄層平整度下降;而反向峰值電流密度從6 A/dm2增加到12A/dm2時(shí),晶粒尺寸逐漸變大,結(jié)構(gòu)也變得疏松。正向占空比由20%提高到60%,會(huì)使陰極過(guò)電位增大,從而鑄層晶粒細(xì)化,但是正向占空比過(guò)大會(huì)造成鑄層內(nèi)部出現(xiàn)孔隙,致密度下降;反向占空比從10%提高到40%,鑄層針孔逐漸增多,變得薄脆。通過(guò)計(jì)算織構(gòu)系數(shù),可知在較高的陰極過(guò)電位下,金鑄層的擇優(yōu)取向沿(111)和(222)晶面;低的陰極過(guò)電位下,金鑄層的擇優(yōu)取向則沿(200)晶面。

    Abstract:

    Thick gold material was fabricated in cyanide-free chloroauric acid solution by bipolar pulse reverse technique, influence of forward and reverse current density and duty cycle on the morphology and microstructure of gold deposits were studied and discussed. Results showed that when forward current density increased from 2.25 A/dm2 to 3.75A/ dm2, grain sizes became smaller and gold particles stacked more compact, but overhigh forward current density lead to surface fluctuation and decreasing of gold deposits flatness; While when reverse current density increased from 6 A/ dm2 to 12A/ dm2, grains became larger and structure loosen. Cathodic overpotential would increase when forward duty cycle increased from 20% to 60%, thus refining the gold deposits,grain sizes became smaller, but cracks would appear if forward duty cycle increased too much; While pores appear and deposits grew thinner and became crisp gradually when reverse duty cycle increased from 10% to 40%. By calculating the texture coefficient, gold deposits showed a preferred orientation along (111) and (222) plain under higher cathodic overpotential; while(200)plain was preferred under lower cathodic overpotential.

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雷婷,袁心強(qiáng),王成博,鄭利珊.雙向脈沖參數(shù)對(duì)金鑄層的形貌和結(jié)構(gòu)影響[J].稀有金屬材料與工程,2016,45(5):1257~1263.[Lei Ting, Yuan Xinqiang, Wang Chengbo, Zheng Lishan. Influence of pulse parameters on the morphology and microstructure of gold electrodeposits[J]. Rare Metal Materials and Engineering,2016,45(5):1257~1263.]
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  • 收稿日期:2015-06-16
  • 最后修改日期:2015-08-07
  • 錄用日期:2015-11-18
  • 在線發(fā)布日期: 2016-06-02
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