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Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer
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National Natural Science Foundation of China (50675234)


Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer
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SB RAS Project (III.23.2.1); Fundamental Research Project of Byelorussian AS and Fundamental Research Program OEMMPU RAS “Multiscale Investigation of Properties and Behavior of Advanced Materials”

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    摘要:

    采用Cu作中間層對(duì)工業(yè)純鈦和1Cr18Ni9不銹鋼進(jìn)行了脈沖加壓擴(kuò)散連接。在連接溫度850 ℃，脈沖壓力8~20 MPa工藝條件下，在120~180 s時(shí)間內(nèi)即實(shí)現(xiàn)了鈦與不銹鋼的有效連接，與傳統(tǒng)擴(kuò)散焊相比連接時(shí)間大幅縮短。在Ti/Cu界面生成了大量的Ti-Cu金屬間化合物；而在Cu/不銹鋼界面只生成了Cu在奧氏體不銹鋼中的固溶體，Cu中間層有效地阻隔了Ti與不銹鋼之間的擴(kuò)散和反應(yīng)。在連接時(shí)間為120 s時(shí)得到了最大的連接強(qiáng)度346 MPa。在拉伸載荷下，接頭沿Ti/Cu界面發(fā)生脆性斷裂。脈沖加壓擴(kuò)散連接能在一定程度上降低界面金屬間化合物對(duì)接頭性能的有害作用，提高接頭強(qiáng)度，但不能完全消除界面金屬間化合物對(duì)接頭的不利影響。

    Abstract:

    Impulse pressuring diffusion bonding of commercially pure titanium to 1Cr18Ni9 stainless steel was carried out using a copper interlayer in an attempt to reduce the bonding time and alleviate the detrimental effect of interfacial reaction products on bonding strength. Successful bonding has been achieved at 850 °C under a pulsed pressure of 8~20 MPa within a duration of only 120~180 s, which is notably shortened in comparison with conventional diffusion bonding. Microstructure characterization revealed that a sequence of Ti-Cu intermetallic compounds were formed at the Ti/Cu interface and the Cu/stainless steel interface was characterized by the presence of solid solution of Cu in γ Fe without any interfacial reaction products. Maximum bonding strength of 346 MPa was obtained when the joint was bonded for 120 s. Upon tensile loading, the joints fractured along the Ti/Cu interfacial reaction layer in a brittle cleavage manner, indicating that the impulse pressuring diffusion bonding can alleviate the harmful influence of interfacial intermetallic compounds on joint performances to a certain extent, but it is infeasible in completely eliminating the negative effect of the brittle intermetallic compounds.

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鄧永強(qiáng),盛光敏,尹麗晶. Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer[J].稀有金屬材料與工程,2015,44(5):1041~1045.[Deng Yongqiang, Sheng Guangmin, Yin Lijing. Impulse Pressuring Diffusion Bonding of Titanium to Stainless Steel Using a Copper Interlayer[J]. Rare Metal Materials and Engineering,2015,44(5):1041~1045.]
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  • 收稿日期:2014-05-14
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  • 在線發(fā)布日期: 2015-06-08
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