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The cold rolling texture and recrystallization texture of the 99 % reduced Cu-45Ni alloy substrates with thickness of 80 and 40 μm were investigated by XRD. The recrystallization evolution of those two Cu-45Ni alloy substrates were also investigated by electron backscattered diffraction (EBSD). The cube texture formation of Cu-45Ni alloy substrates with different thicknesses were demonstrated from the fraction of cube texture, low angle grain boundaries, and the average grain size. The results show that a “Copper” type rolling texture is obtained after 99% deformation reduction for both two tapes, and the rolling texture causes little impact on the cube texture formation. The substrates with 40 μm in thickness have a stronger cube texture and a high fraction of low angle grain boundaries. It is because the probability is higher that two cube grains meet and grow up fast to form a strong cube texture in the substrate with small thickness during partial recrystallization.