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熱等靜壓制備銅金剛石復(fù)合材料
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中國(guó)人民大學(xué)物理系,中國(guó)人民大學(xué)物理系,中國(guó)科學(xué)院福建物質(zhì)結(jié)構(gòu)研究所,中國(guó)科學(xué)院福建物質(zhì)結(jié)構(gòu)研究所,中國(guó)人民大學(xué)物理系,中國(guó)人民大學(xué)物理系,中國(guó)人民大學(xué)物理系

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TB333; TF124

基金項(xiàng)目:

中國(guó)國(guó)家自然科學(xué)基金(51272282, 51302311),北京市教育委員會(huì)-科學(xué)研究與研究生培養(yǎng)共建項(xiàng)目.


Fabrication of Diamond/copper Composites by Hot Isostatic Pressing
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Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,Fujian,Fujian Institute of Research on the Structure of Matter,Chinese Academy of Sciences,Fuzhou,Fujian,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing,Beijing Key Laboratory of Opto-electronic Functional Materials Micro-nano Devices,Department of Physics,Renmin University of China,Beijing

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    摘要:

    利用包套熱等靜壓（HIP）燒結(jié)在900 ℃溫度和110 MPa壓力下燒結(jié)1 h實(shí)現(xiàn)了銅金剛石復(fù)合材料的制備，并對(duì)復(fù)合材料的顯微結(jié)構(gòu)和熱學(xué)性能進(jìn)行了研究，結(jié)果表明：該材料中金剛石分布均勻且未發(fā)生石墨化。隨著金剛石體積分?jǐn)?shù)的增加，復(fù)合材料的致密度、熱導(dǎo)率與熱膨脹系數(shù)下降。制得樣品中的最高致密度和熱導(dǎo)率分別為98.5%和305 W/mK。和熱壓燒結(jié)（HP）及放電等離子體燒結(jié)（SPS）相比，熱等靜壓制得的銅金剛石復(fù)合材料的熱導(dǎo)率達(dá)到相同水平甚至更高?？梢?jiàn)，熱等靜壓在制備銅金剛石復(fù)合材料上擁有很大潛力。

    Abstract:

    Diamond/copper composites were successfully fabricated by hot isostatic pressing(HIP) at a temperature of 900 ℃ and a pressure of 110 MPa for 1 h, and their microstructure and thermal properties were also studied. The results show that diamond particles are dispersed homogeneously in the copper matrix without evident graphitization. With increasing volume fraction of diamond, the relative density, thermal conductivity and coefficient of thermal expansion of the composites decrease. The maximum relative density and thermal conductivity of these samples are up to 98.5% and 305 W/mK, respectively. The diamond/copper composites prepared by HIP can achieve equal or even higher thermal conductivity than those fabricated by hot pressing(HP) and spark plasma sintering(SPS). Obviously, HIP shows great potential in preparing diamond/copper composites.

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王方宇,王文超,石 明,林 岳,郭 旺,袁軒一,曹永革.熱等靜壓制備銅金剛石復(fù)合材料[J].稀有金屬材料與工程,2017,46(3):853~856.[Wang Fangyu, Wang Wenchao, Shi Ming, Lin Yue, Guo Wang, Yuan Xuanyi, Cao Yongge. Fabrication of Diamond/copper Composites by Hot Isostatic Pressing[J]. Rare Metal Materials and Engineering,2017,46(3):853~856.]
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  • 收稿日期:2015-01-09
  • 最后修改日期:2015-03-28
  • 錄用日期:2015-05-13
  • 在線發(fā)布日期: 2017-05-18
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