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Cu含量對(duì)Ti-Al-Si-Cu-N納米薄膜結(jié)構(gòu)及高溫抗氧化性能的影響
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南昌航空大學(xué)材料科學(xué)與工程學(xué)院,南昌航空大學(xué),南昌航空大學(xué),江西科技師范大學(xué),南昌航空大學(xué),南昌航空大學(xué)

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TG174.444

基金項(xiàng)目:

國(guó)家自然科學(xué)基金項(xiàng)目（面上項(xiàng)目，重點(diǎn)項(xiàng)目，重大項(xiàng)目）


Effects of Cu content on microstructure and high-temperature oxidation behavior of Ti-Al-Si-Cu-N nanocomposite films
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Materials Science and Engineering, Nanchang Hangkong University,Nanchang Hangkong University,Nanchang Hangkong University,Jiangxi Science and Technology Normal University,Nanchang Hangkong University,Nanchang Hangkong University

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    摘要:

    本文通過磁控濺射技術(shù)，在AISI-304不銹鋼表面制備了不同Cu含量的Ti-Al-Si-Cu-N納米復(fù)合涂層。通過掃描電鏡（SEM）、能譜儀（EDS）、X射線衍射（XRD）、納米壓痕儀和自制壓痕儀等設(shè)備研究了Ti-Al-Si-N 和 Ti-Al-Si-Cu-N 納米復(fù)合涂層的結(jié)構(gòu)和在800℃氧化的行為。研究結(jié)果表明：隨著涂層中Cu含量的增加，涂層表面的微孔數(shù)量減少，涂層更加致密，涂層晶粒尺寸減小，擇優(yōu)取向由（111）向（110）逐漸轉(zhuǎn)變。涂層的硬度由14.76 GPa 增加至19.42 GPa。Cu含量為1.72 at%的Ti-Al-Si-Cu-N 彈性模量最小，為104.5 GPa。 Cu元素對(duì)Ti-Al-Si-Cu-N納米復(fù)合涂層抗氧化性能有兩方面：一是促進(jìn)Al元素的擴(kuò)散，二是在氧化膜表面形成裂紋和微孔缺陷。Ti-Al-Si-N 涂層比Ti-Al-Si-Cu-N涂層具有更好的抗氧化性能。

    Abstract:

    In this study, Ti-Al-Si-Cu-N nanocomposite films with different Cu contents were deposited on AISI-304 stainless steel by DC reactive magnetron sputtering. Both Ti-Al-Si-N and Ti-Al-Si-Cu-N nanocomposite films were oxidized at 800℃ to investigate the influence of Cu content on the microsturcture and high temperature oxidation resistance by means of scanning electron microscope(SEM), energy disperse spectroscopy(EDS), X-ray diffraction(XRD), nanoindentation tester and a home-made indentation system. The results indicated that with increasing copper content in the films, the micropores disappeared from the surface of Ti-Al-Si-N nanocomposite film and the compact films were obtained. A reduction of the grain size and a change of the (111) preferred orientation to (110) were observed. The microhardness of films increased from 14.76 GPa to 19.42 GPa. The elasticity modulus of Ti-Al-Si-Cu-N films with 1.72 at.% Cu content had the minimum value of 104.5 GPa. The incorporation of copper at high temperature had two effects, one was that the diffusion rate of Al element was advanced another was the crack of oxide layer was induced and the micropores were produced. Ti-Al-Si-N films had a better oxidation resistance than that of the films added Cu element.

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馮長(zhǎng)杰,陳恩,吳娜梅,李明升,江鳶飛,袁爍. Cu含量對(duì)Ti-Al-Si-Cu-N納米薄膜結(jié)構(gòu)及高溫抗氧化性能的影響[J].稀有金屬材料與工程,2017,46(3):627~633.[fengchangjie, chenen, wunamei, limingsheng, jiangyuanfei, yuanshuo. Effects of Cu content on microstructure and high-temperature oxidation behavior of Ti-Al-Si-Cu-N nanocomposite films[J]. Rare Metal Materials and Engineering,2017,46(3):627~633.]
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  • 收稿日期:2014-11-27
  • 最后修改日期:2016-03-17
  • 錄用日期:2016-03-29
  • 在線發(fā)布日期: 2017-05-18
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