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Direct Electrodeposition of Fe-Ni Alloy Films on Silicon Substrate
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Direct Electrodeposition of Fe-Ni Alloy Films on Silicon Substrate
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National Natural Science Foundation of China (51274107); China Postdoctoral Science Foundation Funded Project (2013M531986); Fund for Fostering Talents of Kunming University of Science and Technology (KKSY201251115)

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    摘要:

    在n-型Si片 (100) 面上直接電沉積Fe-Ni合金薄膜，并對電沉積過程特征及薄膜的結(jié)構(gòu)和性能進行了研究。當陰極電流密度高于1.0 A/dm2時，可獲得連續(xù)致密的合金薄膜，且電沉積表現(xiàn)為異常共沉積過程。在1.0~4.0 A/dm2 范圍內(nèi)改變電流密度可調(diào)控合金薄膜的Ni質(zhì)量分數(shù)從45%到78%之間改變，對應的電流效率在60%到66%之間變動。從XRD和TEM結(jié)果來看，合金薄膜由尺寸為 10~30 nm的納米晶粒組成，且表現(xiàn)為Fe-Ni面心立方固溶體結(jié)構(gòu)。合金薄膜的磁滯回線表現(xiàn)出較高的飽和磁化強度和接近于零的矯頑力，表明該種納米合金薄膜具有很好的軟磁性能。

    Abstract:

    The direct electroplating of Fe-Ni alloy films onto (100) n-type Si substrates were conducted. The electrodeposition phases, the film structure and the performance were investigated. The results show that when the current density is above 1.0 A/dm2, continuous films are formed and show an anomalous co-deposition progress occurs. When films are prepared with the current density from 1.0 to 4.0 A/dm2 the nickel composition can be adjusted from 45% to 78% (mass fraction), and the corresponding current efficiencies are from about 60% to 66%. The films consisting of 10~30 nm nanocrystallites show the fcc structure of solid solution of Fe-Ni. The magnetic hystersis loops of the alloy films exhibit a higher saturation magnetization and a very low coercive filed approaching zero, indicating that nanosized alloy films have very good soft magnetic performance.

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劉意春,張家敏,嚴繼康,杜景紅,甘國友,易健宏. Direct Electrodeposition of Fe-Ni Alloy Films on Silicon Substrate[J].稀有金屬材料與工程,2014,43(12):2966~2968.[Liu Yichun, Zhang Jiamin, Yan Jikang, Du Jinghong, Gan Guoyou, Yi Jianhong. Direct Electrodeposition of Fe-Ni Alloy Films on Silicon Substrate[J]. Rare Metal Materials and Engineering,2014,43(12):2966~2968.]
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  • 收稿日期:2013-12-15
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  • 在線發(fā)布日期: 2015-04-16
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