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Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate
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Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate
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National Natural Science Foundation of China (51101017, 51174008)

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    摘要:

    利用靜滴法研究了Sn-Cu-Ag/Cu體系熔融焊料的潤濕機理，結(jié)果發(fā)現(xiàn)，700 K是合金焊料鋪展機理的轉(zhuǎn)折點。利用DTA分析方法研究了界面反應(yīng)，采用Kissinger方法計算了界面反應(yīng)熱動力學參數(shù)，另外，還研究了元素Cu對提高Sn-Ag-Cu/Cu體系界面反應(yīng)活化能的影響及對界面反應(yīng)速率的抑制作用。

    Abstract:

    The sessile drop method was used in the present experiment to study the spreading wetting principle. It is found that 700 K is an important point for the spreading mechanism of the alloy. DTA (Differential Thermal Analysis) was used to analyze the interfacial reaction and the Kissinger method was used to calculate the reaction thermo-kinetics parameters. In addition, it was investigated that element Cu improved the activation energy of Sn-Ag-Cu/Cu system, and suppressed interface reaction rate.

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徐紅艷,袁章福. Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate[J].稀有金屬材料與工程,2014,43(12):2893~2897.[Xu Hongyan, Yuan Zhangfu. Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate[J]. Rare Metal Materials and Engineering,2014,43(12):2893~2897.]
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  • 收稿日期:2014-05-15
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  • 在線發(fā)布日期: 2015-04-16
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