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工藝參數(shù)對鎢絲表面無氰鍍金質(zhì)量的影響
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Effects of Technological Parameters on the Quality of Electrodeposited Gold Film on Tungsten Helix
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    摘要:

    為了實(shí)現(xiàn)鎢螺旋線表面鍍金薄膜質(zhì)量可控，研究了無氰電鍍過程中工藝參數(shù)如電流密度、鍍液溫度和沉積時(shí)間對鍍金層質(zhì)量的影響規(guī)律。利用掃描電子顯微鏡對鍍金層形貌進(jìn)行觀察分析。結(jié)果表明：電流密度影響鍍金薄膜的表面平整度及晶粒大?。诲円簻囟扔绊憻o氰鍍液穩(wěn)定性，從而影響薄膜的表面光澤度及平整度；電沉積時(shí)間對鍍層覆蓋效果影響較大。沉積時(shí)間過短，鍍層覆蓋效果差；時(shí)間過長，邊角效應(yīng)嚴(yán)重。沉積時(shí)間宜控制在1.5 h內(nèi)

    Abstract:

    To control the surface quality of gold films electrodeposited on tungsten helix, the effects of current density, electrolytic temperature and deposition time on the electrodeposits were studied. The morphology of gold films was evaluated by means of scanning electron microscope (SEM). The results indicate that current density affects the grain size of the film. When electrodepositing at higher current density, the surface defects such as burring and sponge feature the gold film. The electrolytic temperature causes poorer stability of electrolytic solution and deposition quality. In addition, the variation of deposition time results in different electrodeposits quality. With increasing the deposition time, the edge effect is serious. The proper deposition time is about 1.5 h

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范愛玲,丁艷鳳,張 姍,馬 捷,魏建忠.工藝參數(shù)對鎢絲表面無氰鍍金質(zhì)量的影響[J].稀有金屬材料與工程,2014,43(11):2847~2850.[Fan Ailing, Ding Yanfeng, Zhang Shan, Ma Jie, Wei Jianzhong. Effects of Technological Parameters on the Quality of Electrodeposited Gold Film on Tungsten Helix[J]. Rare Metal Materials and Engineering,2014,43(11):2847~2850.]
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  • 收稿日期:2013-11-18
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  • 在線發(fā)布日期: 2015-04-07
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