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Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers
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Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers
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Program of the Pearl River Young Talents of Science and Technology in Guangzhou (2013J2200033); the Project of Guangdong Provincial Key Laboratory (2012A061400011) and the Guangdong Innovative Research Team Program (201101C0104901263)

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    摘要:

    研究涉及新型金剛石熱沉與LED芯片銅組件的高導(dǎo)熱連接問題。制備和分析了AlNi微納多層膜,并將其應(yīng)用于金剛石和銅組件進行自蔓延連接。熱分析和顯微組織觀察結(jié)果表明雙金屬層(Al/Ni多層膜結(jié)構(gòu)中Al層和Ni層交替一次的雙層厚度)顯著影響自蔓延反應(yīng)放熱,同時對穩(wěn)定和控制焊接工藝有重要作用;進而討論了釩元素添加和電磁致導(dǎo)磁效應(yīng)與微納多層膜結(jié)構(gòu)和雙金屬層的關(guān)系;最終接頭質(zhì)量檢測表明,微納多層膜自蔓延法焊接的接頭質(zhì)量優(yōu)于現(xiàn)用銀膠連接

    Abstract:

    A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity

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張宇鵬,易江龍,羅子藝,許 磊,陳和興,代明江. Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers[J].稀有金屬材料與工程,2014,43(11):2597~2601.[Zhang Yupeng, Yi Jianglong, Luo Ziyi, Xu Lei, Chen Hexing, Dai Mingjiang. Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers[J]. Rare Metal Materials and Engineering,2014,43(11):2597~2601.]
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  • 收稿日期:2014-05-15
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  • 在線發(fā)布日期: 2015-04-07
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