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Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al2O3 Ceramic
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Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al2O3 Ceramic
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Pearl River Young Talents of Science and Technology in Guangzhou (2013J2200033); Guangdong Provincial Key Laboratory (2012A061400011) and the Guangdong Innovative Research Team Program (201101C0104901263)

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    摘要:

    研究制備系列具有不同調(diào)制周期的Al-Ni多層膜，并將其應(yīng)用于銅與氧化鋁陶瓷件的TLP（transient-liquid-phase，瞬間液相）連接。分別對制備的系列多層膜及金屬陶瓷接頭微觀組織進(jìn)行表征，同時(shí)采用DSC及XRD對反應(yīng)多層膜反應(yīng)特性進(jìn)行研究。研究結(jié)果表明，采用Al/Ni微納尺度多層膜不僅可降低銅與氧化鋁連接溫度，并能提高焊接接頭質(zhì)量

    Abstract:

    A series of Al-Ni reactive multilayer with different modulation periods were fabricated by DC magnetron sputtering process, and transient-liquid-phase (TLP) bonding of copper and Al2O3 ceramic was carried out by the multilayer foils. The microstructure of the as-deposited foils and the cermet joint were investigated. The reaction behaviors of Al/Ni multilayers were characterized by means of DSC and X-ray diffraction. The results show that the application of Al/Ni multilayer foils not only decreases the joining temperature of the copper and Al2O3 ceramic, but also improves the quality of the joint

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易江龍,張宇鵬,胡海春,王昕昕,陳和興,代明江. Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al2O3 Ceramic[J].稀有金屬材料與工程,2014,43(11):2593~2596.[Yi Jianglong, Zhang Yupeng, Hu Haichun, Wang Xinxin, Chen Hexin, Dai Mingjiang. Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al2O3 Ceramic[J]. Rare Metal Materials and Engineering,2014,43(11):2593~2596.]
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  • 收稿日期:2014-05-15
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  • 在線發(fā)布日期: 2015-04-07
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