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固溶處理對(duì)GH864合金裂紋擴(kuò)展速率的影響
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國(guó)家自然科學(xué)基金（50771011）


Effect of the Solution Treatment on the Crack Propagation Rates of GH864 Alloy
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    摘要:

    研究不同固溶處理后GH864合金650 ℃裂紋擴(kuò)展速率的變化規(guī)律。結(jié)果表明：隨晶粒尺寸和固溶溫度增加，裂紋擴(kuò)展速率呈先降低后增加的趨勢(shì)。根據(jù)多組試驗(yàn)數(shù)據(jù)擬合得到GH864合金晶粒尺寸與裂紋擴(kuò)展速率的關(guān)系式，預(yù)測(cè)GH864合金晶粒尺寸在100 μm左右，抗裂紋擴(kuò)展能力可能存在最佳值。同時(shí)得到GH864合金固溶溫度與裂紋擴(kuò)展速率的關(guān)系式。用不同固溶溫度將裂紋擴(kuò)展速率變化規(guī)律劃分為5個(gè)區(qū)域，低于固溶溫度1080 ℃裂紋擴(kuò)展速率隨固溶溫度增加而降低，1080℃固溶處理后合金的裂紋擴(kuò)展速率最低，高于固溶溫度1080 ℃裂紋擴(kuò)展速率隨固溶溫度增加而增加。精準(zhǔn)控制固溶溫度可得到合適的晶粒尺寸和較好抗裂紋擴(kuò)展能力。

    Abstract:

    The effect of the solution treatment on the crack growth rate regularity of GH864 alloy was studied at 650 oC. The results indicated that the crack growth rate firstly decreases and then increases with increasing grain size and solution temperature. The relationship between grain size and the crack growth rate was fitted according to milt-group test data. It is predicted that the crack growth resistance may have an optical point when the grain size reaches 100 μm. The relationship between solution temperature and the crack growth rate of GH864 alloy was concluded. The crack growth rate regularity of GH864 alloy is divided into five areas by different solution temperatures. The crack growth rate is decreased with increasing the solution temperature when the solution temperature is below 1080 oC, and the lowest occurs at the solution temperature 1080 oC while the rate is increased with increasing the solution temperature when the solution temperature is higher than 1080 oC. The crack growth resistance may be obtained by precisely controlling solution temperature and grain size.

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王 璞,董建新.固溶處理對(duì)GH864合金裂紋擴(kuò)展速率的影響[J].稀有金屬材料與工程,2014,43(10):2502~2506.[Wang Pu, Dong Jianxin. Effect of the Solution Treatment on the Crack Propagation Rates of GH864 Alloy[J]. Rare Metal Materials and Engineering,2014,43(10):2502~2506.]
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  • 收稿日期:2013-10-12
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  • 在線發(fā)布日期: 2015-04-07
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