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WLCSP30器件SnAgCuFe焊點(diǎn)可靠性
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江蘇師范大學(xué)

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國家自然科學(xué)基金 (51371097)；江蘇省精密制造工程技術(shù)研究開發(fā)中心開放基金 (ZK13-02-02)


Reliability of SnAgCuFe solder joints in WLCSP30 device
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Jiangsu Normal University

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    Anand constitutive model of SnAgCuFe solder joints was studied, and the nine parameters was determined based on tensile testing. And the model was incorporated in finite element code for analyze the stress-strain response of SnAgCuFe solder joints in WLCSP30 device. The results indicate that the maximum stress concentrates on the top surface of corner solder joints, and the stress-strain of SnAgCuFe solder joints is lower than that of SnAgCu solder joints. Based on the fatigue life model, the addition of Fe can enhance the fatigue life of SnAgCu solder joints, therefore, the SnAgCuFe solders can replace the traditional SnPb to be used in electronic packaging.

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引用本文

張亮. WLCSP30器件SnAgCuFe焊點(diǎn)可靠性[J].稀有金屬材料與工程,2016,45(11):2823~2826.[zhangliang. Reliability of SnAgCuFe solder joints in WLCSP30 device[J]. Rare Metal Materials and Engineering,2016,45(11):2823~2826.]
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  • 收稿日期:2014-07-28
  • 最后修改日期:2014-08-29
  • 錄用日期:2014-11-20
  • 在線發(fā)布日期: 2016-12-08
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