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無鉛焊點及其內(nèi)部金屬間化合物的力學(xué)性能研究
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國家自然科學(xué)基金 (11172195)；太原理工大學(xué)2012年校青年基金 (2012L093)


Mechanical Properties of Lead-Free Solder Joints and Its Inner Intermetallic Compounds
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    摘要:

    采用納米壓痕技術(shù)對無鉛焊點 (Sn3.0Ag0.5Cu、Sn0.7Cu和Sn3.5Ag) 及其內(nèi)部界面金屬間化合物 (intermetallic compound, IMC)的力學(xué)性能進行測試。根據(jù)實際工業(yè)工藝流程制備無鉛焊點試樣；利用接觸剛度連續(xù)測量(CSM)技術(shù)對焊點及內(nèi)部IMC層進行測試，得到IMC層及無鉛焊點的彈性模量、硬度等力學(xué)性能參數(shù)，并根據(jù)載荷-位移曲線的保載階段確定蠕變應(yīng)力指數(shù)。結(jié)果表明，Sn0.7Cu的IMC層的彈性模量和蠕變應(yīng)力指數(shù)為無鉛焊點的2.03和6.73倍；對無鉛焊點的可靠性評估中，將IMC層的影響考慮進去使得結(jié)果更為合理

    Abstract:

    The mechanical properties of lead-free solder (Sn3.0Ag0.5Cu, Sn0.7Cu and Sn3.5Ag) joints and its inner intermetallic compounds (IMC) were measured by nanoindentation. The samples were prepared according to actual reflow soldering condition and service. Using the continuous stiffness measurement (CSM) technique, the values of hardness and elastic modulus for lead-free solder joints and IMC were measured. The creep stress exponents were obtained according to nanoindentation. The result indicates that the elastic modulus and creep stress exponents of IMC of Sn0.7Cu are 2.03 and 6.73 times of lead-free solders. It is reasonable to consider the influence of the IMC layer when evaluating the lead-free solder joints reliability

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袁國政,楊雪霞,肖革勝,樹學(xué)峰.無鉛焊點及其內(nèi)部金屬間化合物的力學(xué)性能研究[J].稀有金屬材料與工程,2014,43(5):1153~1156.[Yuan Guozheng, Yang Xuexia, Xiao Gesheng, Shu Xuefeng. Mechanical Properties of Lead-Free Solder Joints and Its Inner Intermetallic Compounds[J]. Rare Metal Materials and Engineering,2014,43(5):1153~1156.]
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  • 收稿日期:2013-08-01
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  • 在線發(fā)布日期: 2014-10-13
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