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Ti-Nb-Cu作緩沖層的TiC金屬陶瓷/304不銹鋼擴(kuò)散連接
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重慶大學(xué),重慶大學(xué),重慶大學(xué)

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TG457

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國(guó)家自然科學(xué)基金項(xiàng)目（面上項(xiàng)目，重點(diǎn)項(xiàng)目，重大項(xiàng)目）


Ti-Nb-Cu stress buffer layer for TiC cermet/304 stainless steel diffusion bonding
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Chongqing University,Chongqing University,Chongqing University

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    摘要:

    對(duì)TiC金屬陶瓷和304不銹鋼進(jìn)行真空擴(kuò)散連接實(shí)驗(yàn)，并采用Ti/Nb/Cu中間層以實(shí)現(xiàn)活性連接并緩解接頭殘余應(yīng)力的目的。對(duì)焊接接頭進(jìn)行詳細(xì)的組織分析和力學(xué)性能測(cè)試來(lái)評(píng)估焊接工藝。分析發(fā)現(xiàn)在TiC金屬陶瓷和304不銹鋼之間形成明顯的轉(zhuǎn)變過(guò)渡區(qū)，界面反應(yīng)產(chǎn)物為（Ti,Nb），剩余Nb，剩余Cu以及 Cu（s.s）。連接溫度925℃，保溫時(shí)間20min，壓力8MPa下得到的接頭剪切強(qiáng)度達(dá)84.6MPa，此時(shí)脆性斷裂發(fā)生在靠近界面處的陶瓷內(nèi)部。結(jié)果表明，中間層Ti/Nb/Cu的合理選擇能很好的降低金屬間化合物對(duì)接頭性能的有害作用，而且Nb對(duì)接頭殘余應(yīng)力的改善起到關(guān)鍵作用，有效的提高了接頭強(qiáng)度。

    Abstract:

    Vacuum diffusion bonding of TiC cermet/304 stainless steel was conducted and Ti-Nb-Cu multi-interlayer was intended to achieve active bonding and residual stress relieving. Detailed microstructure characterization and mechanical properties assessment was carried out to evaluate the bonding technology. It was found that an obvious transition zone was formed at the interfaces and the detailed interfacial products were (Ti,Nb), remnant Nb, remnant Cu and Cu(s.s). The shear strength of TiC/Ti-Nb-Cu/304SS joint up to 84.6 MPa by controlling heating to 925℃ and hold for 20 min under a pressure of 8MPa. Failure occurred within TiC cermet near the interface in a brittle manner. The results indicated that Ti/Nb/Cu can be effectively reduce the harmful effects of intermetallic compounds on the joint performance, and the Nb interlayer plays a major role in the relief of the residual stress.

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李佳,盛光敏,黃利. Ti-Nb-Cu作緩沖層的TiC金屬陶瓷/304不銹鋼擴(kuò)散連接[J].稀有金屬材料與工程,2016,45(3):555~560.[lijia, shengguangmin, huangli. Ti-Nb-Cu stress buffer layer for TiC cermet/304 stainless steel diffusion bonding[J]. Rare Metal Materials and Engineering,2016,45(3):555~560.]
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  • 收稿日期:2014-03-12
  • 最后修改日期:2014-07-13
  • 錄用日期:2014-08-12
  • 在線發(fā)布日期: 2016-07-06
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