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不同沉積溫度對納米Ti薄膜微觀結(jié)構(gòu)和殘余應(yīng)力的影響
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哈爾濱工程大學(xué),哈爾濱工程大學(xué),裝甲兵工程學(xué)院,中國地質(zhì)大學(xué)(北京),哈爾濱工程大學(xué),裝甲兵工程學(xué)院

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TG133.25

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國家杰出青年科學(xué)基金


The Effect of Different Substrate Temperatures on the Microstructure and Residual Stress of Ti Film
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Harbin Engineering University,Harbin Engineering University,Academy of Armored Forces Engineering,China University of Geosciences,Harbin Engineering University,Academy of Armored Forces Engineering

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    摘要:

    本實驗采用納米壓痕技術(shù)利用Suresh模型和Lee模型研究了直流磁控濺射制備薄膜時，不同基底溫度對Ti薄膜內(nèi)部殘余應(yīng)力的影響，并將其計算結(jié)果與曲率法測試結(jié)果進行比較分析。同時結(jié)合原子力和XRD對薄膜表面形貌和微觀結(jié)構(gòu)進行了分析。研究發(fā)現(xiàn)：Suresh模型的計算結(jié)果與曲率法測量結(jié)果更為接近，Lee模型更適合對Ti薄膜中的應(yīng)力大小進行計算。計算結(jié)果表明：金屬Ti薄膜表面晶粒隨基底溫度的增加先增大后減小，薄膜中的殘余應(yīng)力則由壓應(yīng)力轉(zhuǎn)變?yōu)槔瓚?yīng)力。

    Abstract:

    In this paper, the influence of different substrate temperatures of Ti film prepared by the direct current (DC) magnetron sputtering on the internal residual stress of Ti film was investigated experimentally by nanoindentation technique using Suresh model and Lee model. The comparison between the results of nanoindentation method and curvature method was performed. At the same time, the surface morphology and microstructure of Ti film are analyzed using atomic force microscope (AFM) and X-ray diffraction (XRD). The results showed that the residual stress value obtained using Suresh model was almost the same as that by the curvature method, so the Suresh model is more suitable for calculating the residual stress of Ti film. Together with the nanoindentation data and micro-structure analysis, it was found that with the substrate temperature rising, the grain size of Ti film first increased and then decreased; the residual stress of the Ti film changed from the compressive stress to tensile stress.

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董美伶,崔秀芳,王海斗,朱麗娜,金國,徐濱士.不同沉積溫度對納米Ti薄膜微觀結(jié)構(gòu)和殘余應(yīng)力的影響[J].稀有金屬材料與工程,2016,45(4):843~848.[dongmeiling, cuixiufang, wanghaidou, zhulina, jinguo, xubinshi. The Effect of Different Substrate Temperatures on the Microstructure and Residual Stress of Ti Film[J]. Rare Metal Materials and Engineering,2016,45(4):843~848.]
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  • 收稿日期:2014-02-20
  • 最后修改日期:2014-08-31
  • 錄用日期:2014-09-28
  • 在線發(fā)布日期: 2016-06-27
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