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SnAgCu無(wú)鉛焊點(diǎn)低周疲勞行為研究
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北京工業(yè)大學(xué)

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TG425.1

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國(guó)家自然科學(xué)基金項(xiàng)目（面上項(xiàng)目，重點(diǎn)項(xiàng)目，重大項(xiàng)目）；北京市自然科學(xué)基金


Low Cycle Fatigue Behavior of SnAgCu Solder Joints
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Beijing University of Technology

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    摘要:

    在25℃下利用單軸微力疲勞試驗(yàn)機(jī)對(duì)96.5Sn-3Ag-0.5Cu無(wú)鉛焊點(diǎn)進(jìn)行不同頻率（1Hz~10Hz）和應(yīng)變范圍（2%~8%）的低周疲勞試驗(yàn)。結(jié)果表明，不同應(yīng)變范圍條件下無(wú)鉛焊點(diǎn)的低周疲勞行為符合Coffin-Manson方程。頻率修正的Coffin-Manson方程可以用來(lái)描述頻率對(duì)無(wú)鉛焊點(diǎn)低周疲勞壽命的影響。疲勞裂紋首先在焊點(diǎn)邊緣的釬料與金屬間化合物（IMC）之間的界面處萌生，隨后，裂紋沿近IMC層的釬料內(nèi)進(jìn)行擴(kuò)展。不同頻率條件下焊點(diǎn)的斷口形貌主要分為三個(gè)特征區(qū)域：裂紋萌生區(qū)、裂紋擴(kuò)展區(qū)和最終斷裂區(qū)。隨著頻率的升高，焊點(diǎn)的斷裂機(jī)制由沿晶斷裂向穿晶斷裂轉(zhuǎn)變。

    Abstract:

    Low cycle mechanical fatigue tests on 96.5Sn-3Ag-0.5Cu solder joints were carried out using micro-uniaxial fatigue testing system at 25℃ with different frequencies (1Hz~10Hz) and a wide range of strain (2%~8%). The results showed that the low cycle fatigue (LCF) life followed the Coffin-Manson equation in different strain ranges. Frequency-modified Coffin-Manson equation can describe the frequency effect well on the fatigue life of solder joints. The analysis of failure process showed that the fatigue cracks initiated at the interfaces between the solder and inter-metallic compound (IMC) around the edge of the joints, then the cracks propagated within the solder along the solder/IMC interfaces proximately. Fracture morphologies of solder joints with different frequencies were similar which mainly consisted of an initiated region, a propagation region and a final fracture region. The fracture mechanism of the final fracture region transformed from inter-granular fracture to trans-granular fracture with increasing frequency.

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王超. SnAgCu無(wú)鉛焊點(diǎn)低周疲勞行為研究[J].稀有金屬材料與工程,2016,45(4):829~835.[WangChao. Low Cycle Fatigue Behavior of SnAgCu Solder Joints[J]. Rare Metal Materials and Engineering,2016,45(4):829~835.]
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  • 收稿日期:2014-02-10
  • 最后修改日期:2014-03-17
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  • 在線發(fā)布日期: 2016-06-01
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