Abstract:A non-cyanide sulfite bath pulse electroplating process for Au-Pd-Cu alloy was investigated. Thinking about the coating’s surface morphology and the plating’s deposition rate, the optimized electroplating parameters were found as follows: current density 0.25A/dm2, duty ratio 10%, pulse frequency 900Hz, temperature 60℃. Tra-depth microscope was used to observe coating’s surface morphology, and X-ray diffraction was used to analyze the phase components. Meanwhile, the coating’s binding force was tested by means of thermal shock test and root bend test.Furthermore, the coating’s hardness was meatured by Vickers. The results showed that there were only Au, Pd and Cu in the coating without any impurity elements and the coating had fine and uniform grains, with high hardness, excellent adhesion, low porosity, good smoothness and free of cracks.