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納米顆粒復合釬料攪拌輔助低溫釬焊接頭力學性能
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重慶高校優(yōu)秀成果轉(zhuǎn)化資助重大項目(KJZH11215); 國家自然科學基金 (50975303); 重慶理工大學科研啟動基金(2012ZD12)


Mechanical Property for the Soldering Joints of Nano-Particle Composite Solder with Low-Temperature Stir Soldering
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    摘要:

    采用攪拌輔助低溫（半固態(tài)區(qū)間）釬焊技術(shù)，成功制備了低銀釬料和納米復合釬料釬焊接頭。研究表明，在低銀釬料中加入納米Ni顆粒，能提高釬料的潤濕性和填縫能力，Ni與Cu6Sn5生成孔洞狀的化合物(CuxNi1-x)6Sn5及低溫攪拌形成的微孔成為界面原子的擴散通道，使其界面IMC厚度都明顯高于相同工藝下低銀釬料釬焊接頭。添加納米顆粒后，釬料的抗拉強度較基體提高了15.7%，剪切強度較基體提高了22.9%，釬料及其接頭由脆斷向韌性斷裂轉(zhuǎn)變。在釬劑輔助基礎(chǔ)上施加攪拌，其復合釬料接頭抗拉強度和剪切強度分別較基體釬料的接頭提高了32%和24%，相當甚至優(yōu)于復合釬料本身的抗拉強度和剪切強度

    Abstract:

    The soldering joints of low silver solder and nano-particle composite solder were prepared by low-temperature soldering (at semi-solid state) with stirring. Researches have shown that the wettability and the filling ability of solders are improved by adding nano-Ni particles, the cavitary compounds of (CuxNi1-x) 6 Sn5 are generated by Ni with Cu6Sn5 and the micro voids formed by stirring at low temperature are the diffusion path of interface atoms, and the thickness of IMC increases compared with the soldering joints of low silver solder. The tensile strength and the shear strength is increased by 15.7% and 22.9%, respectively, and the low silver solder and its joints shift from the brittle broken to the ductile fracture after adding nano-particles. The tensile strength and the shear strength of the composites’ soldering joints are increased by 32% and 24%, respectively, compared with the soldering joints of low silver solder using stirring and flux, which is amount to or even better than the tensile strength and the shear strength of nano-particle composite solder

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甘貴生,杜長華,許惠斌,楊 濱,李正康,唐 明,曹明明.納米顆粒復合釬料攪拌輔助低溫釬焊接頭力學性能[J].稀有金屬材料與工程,2013,42(11):2416~2420.[Gan Guisheng, Du Changhua, Xu Huibin, Yang Bin, Li Zhengkang, Tang Ming, Cao Mingming. Mechanical Property for the Soldering Joints of Nano-Particle Composite Solder with Low-Temperature Stir Soldering[J]. Rare Metal Materials and Engineering,2013,42(11):2416~2420.]
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  • 收稿日期:2012-11-25
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